Solder mask ink composition

Patent metadata

Field	Value
Publication number	US-9796864-B2
Application number	US-201414471893-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Aug 28, 2014
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s −1 and greater than 30 cps at a shear rate of 495 s −1 and a temperature of 25° C.

First claim

What is claimed is:

1. A solder mask ink composition, comprising:
an epoxy resin of formula 1

where n ranges from about 2 to about 500;
a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition, wherein the solvent is selected from the group consisting of a dialkylene glycol monoalkyl ether solvent, alkoxybenzene, C 5 to C 8 alcohol and a C 2 to C 4 alkanediol, the solvent having a boiling point that is at least 135° C. at atmospheric pressure; and
a non-ionic surfactant, the non-ionic surfactant being a polyethylene glycol-block-polypropylene glycol-block-polyethylene glycol,
wherein the ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s −1 and a temperature of 25° C. and greater than 100 cps at a shear rate of 495 s −1 and a temperature of 25° C.

2. The composition of claim 1 , wherein the composition has a viscosity that is less than 800 cps at a shear rate of 10 s −1 .

3. The composition of claim 1 , wherein the composition is an aerosol jet ink composition and can be atomized with a pneumatic atomizer.

4. The composition of claim 1 , wherein the solvent has a vapor pressure of less than 5 mm Hg at 20° C.

5. The composition of claim 1 , wherein the dialkylene glycol monoalkyl ether is selected from the group consisting of a diethylene glycol monoalkyl ether and a dipropylene glycol monoalkyl ether.

6. The composition of claim 1 , wherein the solvent is a diethylene glycol monoalkyl ether of the formula:

where R 1 is a C 3 to C 6 alkyl group.

7. The composition of claim 1 , wherein the solvent is butyl carbitol.

8. The composition of claim 1 , wherein the non-ionic surfactant is in an amount of at least 0.01% by weight relative to the total weight of the solder mask ink composition.

9. A solder mask ink composition, comprising:
an epoxy resin of formula 1

where n ranges from about 2 to about 500;
a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition, the solvent being a diethylene glycol monoalkyl ether of the formula:

where R 1 is a C 3 to C 6 alkyl group, the solvent having a boiling point that is at least 135° C. at atmospheric pressure; and
a non-ionic surfactant, wherein the non-ionic surfactant is polyethylene glycol-block-polypropylene glycol-block-polyethylene glycol,
wherein the ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s −1 and a temperature of 25° C. and greater than 100 cps at a shear rate of 495 s −1 and a temperature of 25° C.

Assignees

• Xerox Corp

Inventors

• Wu Yiliang
• Nerger Bryan A

Classifications

• C09D11/102 Primary

  containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds · CPC title

• C08G59/06

  of polyhydric phenols · CPC title

• C08K5/06

  Ethers; Acetals; Ketals; Ortho-esters · CPC title

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• C08G2650/58

  Ethylene oxide or propylene oxide copolymers, e.g. pluronics · CPC title