Polyhydric phenol compound and method of producing same
US-10851039-B2 · Dec 1, 2020 · US
of polyhydric phenols
of polyhydric phenols · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/06 |
| Official title | of polyhydric phenols |
| Display label | of polyhydric phenols |
| Total patents | 119 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 13 |
| 2017 | 9 |
| 2018 | 11 |
| 2019 | 14 |
| 2020 | 13 |
| 2021 | 14 |
| 2022 | 9 |
| 2023 | 12 |
| 2024 | 8 |
| 2025 | 7 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
US-10815405-B2 · Oct 27, 2020 · US
Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
US-2020255653-A1 · Aug 13, 2020 · US
Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board
US-10703855-B2 · Jul 7, 2020 · US
Epoxy formula for integral capacitance probe
US-10703854-B2 · Jul 7, 2020 · US
Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same
US-2020123307-A1 · Apr 23, 2020 · US
Novel low temperature anhydride epoxy cured systems
US-2020087446-A1 · Mar 19, 2020 · US
Polymer thick film dielectric paste composition
US-2019387621-A1 · Dec 19, 2019 · US
Epoxy resin system for making carbon fiber composites
US-10479858-B2 · Nov 19, 2019 · US
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
US-10465089-B2 · Nov 5, 2019 · US
Toughening of epoxy thermosets
US-10428175-B2 · Oct 1, 2019 · US
Epoxy adhesive resistant to open bead humidity exposure
US-2019284454-A1 · Sep 19, 2019 · US
Epoxy resin system
US-10414857-B2 · Sep 17, 2019 · US
Curable Composition
US-2019276587-A1 · Sep 12, 2019 · US
Curable Composition
US-2019276719-A1 · Sep 12, 2019 · US
Polyhydric phenol compound and method of producing same
US-2019210947-A1 · Jul 11, 2019 · US
Epoxy formula for integral capacitance probe
US-2019169355-A1 · Jun 6, 2019 · US
Methods of Preparing Compositions for Containers and Other Articles and Methods of Using Same
US-2019048126-A1 · Feb 14, 2019 · US
Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board
US-2019023832-A1 · Jan 24, 2019 · US
One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
US-2019010373-A1 · Jan 10, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/06?
- CPC C08G59/06 is the Cooperative Patent Classification code for “of polyhydric phenols.”
- How many patents are filed under CPC C08G59/06 (of polyhydric phenols)?
- Our database includes 119 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/06 growing?
- Publication counts under this code: 8 in 2024 vs 7 in 2025 (latest complete years).