Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-12512262-B2
Application number	US-202218081962-A
Country	US
Kind code	B2
Filing date	Dec 15, 2022
Priority date	Dec 29, 2021
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

A multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body.

First claim

What is claimed is:

1 . A multilayer electronic component comprising:
a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body and electrically connected to the thermoelectric element and the plurality of internal electrodes.

2 . The multilayer electronic component of claim 1 , wherein the thermoelectric element includes a first-type semiconductor element, a second-type semiconductor element, and a connection electrode connecting the first-type and second-type semiconductor elements to each other.

3 . The multilayer electronic component of claim 2 , wherein the thermoelectric element includes a first electrode connected to the first-type semiconductor element and a second electrode connected to the second-type semiconductor element, and the first electrode and the second electrode are respectively connected to the external electrodes.

4 . The multilayer electronic component of claim 3 , wherein the first electrode, the second electrode and the connection electrode each include at least one of silver (Ag), copper (Cu), nickel (Ni) or an alloy thereof.

5 . The multilayer electronic component of claim 2 , wherein the first-type semiconductor element is an N-type semiconductor element, and the second-type semiconductor element is a P-type semiconductor element.

6 . The multilayer electronic component of claim 2 , further comprising a filling portion disposed in a level between the connection electrode disposed on first end surfaces of a pair of the first-type and second-type semiconductor elements and another connection electrode disposed on second end surfaces of an adjacent pair of the first-type and second-type semiconductor elements.

7 . The multilayer electronic component of claim 2 , wherein the first-type or second-type semiconductor element includes perovskite oxide.

8 . The multilayer electronic component of claim 1 , wherein the body includes a capacitance formation portion including the plurality of internal electrodes and first and second cover portions disposed on opposite surfaces of the capacitance formation portion in the first direction, and
the thermoelectric element is disposed in at least one of the first cover portion or the second cover portion.

9 . The multilayer electronic component of claim 8 , wherein the thermoelectric element includes a first thermoelectric element and a second thermoelectric element respectively disposed in the first cover portion and the second cover portion.

10 . The multilayer electronic component of claim 9 , wherein the first thermoelectric element and the second thermoelectric element are provided in plural, and the plurality of first thermoelectric elements and the plurality of second thermoelectric elements are respectively disposed in the first cover portion and the second cover portion.

11 . The multilayer electronic component of claim 8 , wherein the first and second cover portions each have a thickness of 30 μm or less.

12 . The multilayer electronic component of claim 1 , wherein the thermoelectric element includes a plurality of first-type semiconductor elements, a plurality of second-type semiconductor elements, and a plurality of connection electrodes respectively connecting the plurality of first-type and the plurality of second-type semiconductor elements to each other.

13 . The multilayer electronic component of claim 1 , wherein the thermoelectric element comprises a plurality of thermoelectric elements disposed in the body.

14 . The multilayer electronic component of claim 1 , wherein the thermoelectric element is not exposed to any of opposite surfaces of the body in the first direction.

15 . The multilayer electronic component of claim 1 , wherein each of the external electrodes includes a first electrode layer disposed on the body and including a conductive metal and glass and a second electrode layer disposed on the first electrode layer and including a conductive metal.

16 . The multilayer electronic component of claim 15 , wherein the second electrode layer is a multilayer including a first layer including nickel (Ni) as the conductive metal and a second layer including tin (Sn) as the conductive metal.

17 . A multilayer electronic component comprising:
a body including a capacitance formation portion having dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween, the body further including at least one cover portion disposed above or below the capacitance formation portion in the first direction; at least one thermoelectric element disposed in the at least one cover portion of the body; and external electrodes disposed outside the body and electrically connected to the at least one thermoelectric element and the plurality of internal electrodes.

18 . The multilayer electronic component of claim 17 , wherein the at least one thermoelectric element includes a first-type semiconductor element, a second-type semiconductor element, and a connection electrode connecting the first-type and second-type semiconductor elements to each other.

19 . The multilayer electronic component of claim 18 , wherein the at least one thermoelectric element further includes a first electrode connected to the first-type semiconductor element and a second electrode connected to the second-type semiconductor element, and the first electrode and the second electrode are respectively connected to the external electrodes in a second direction.

20 . The multilayer electronic component of claim 19 , wherein a plurality of first-type semiconductor elements and a plurality of second-type semiconductor elements are alternately connected in series by a respective one of a plurality of connection electrodes, and
semiconductor elements located at two end portions of the plurality of first-type and second-type semiconductor elements are connected to the first and second electrodes, respectively.

21 . The multilayer electronic component of claim 20 , wherein a set of the plurality of first-type and second-type semiconductor elements connected in series is arranged in plural, and multiple sets of the plurality of first-type and second-type semiconductor elements are arranged and spaced apart from one another in a third direction perpendicular to the first and second directions.

22 . A multilayer electronic component comprising:
a body including dielectric layers and a plurality of first and second internal electrodes alternately stacked with a respective one of the dielectric layers interposed therebetween in a first direction; external electrodes disposed outside the body and having inner surfaces respectively electrically connected to the plurality of first and second internal electrodes; and a thermoelectric element electrically connected to the inner surfaces of the external electrodes.

23 . The multilayer electronic component of claim 22 , wherein the thermoelectric element comprises:
a plurality of first-type semiconductor elements and a plurality of second-type semiconductor elements; a plurality of connection electrodes; and a first electrode and a second electrode, wherein the plurality of first-type semiconductor

Assignees

• Samsung Electro Mech

Inventors

• Yang Chan Ho
• Kim Min Jun
• Baek Jung Mi
• Kim Da Eun
• Park Hye Min
• Kim Jong Min
• Cho Seong Hyeon
• Seo Min San
• Kim Hong Seok

Classifications

• H01G4/258 Primary

  Temperature compensation means · CPC title

• H01G2/14

  Protection against electric or thermal overload (by cooling H01G2/08) · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H10N10/17 Primary

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N10/13

  characterised by the heat-exchanging means at the junction · CPC title