Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-2020006002-A1
Application number	US-201916443933-A
Country	US
Kind code	A1
Filing date	Jun 18, 2019
Priority date	Jun 27, 2018
Publication date	Jan 2, 2020
Grant date	—

Abstract

A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.

First claim

What is claimed is:

1 . A multilayer ceramic electronic component comprising:
a multilayer ceramic electronic component body including:
a multilayer body including a plurality of ceramic layers that are laminated and a plurality of inner electrode layers that are laminated, the multilayer body including a first principal surface and a second principal surface that are opposite to each other in a lamination direction, a first side surface and a second side surface that are opposite to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and a first end surface and a second end surface that are opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction;
a first outer electrode provided on the first end surface, at least a portion of the first side surface, and at least a portion of the second side surface of the multilayer body; and
a second outer electrode provided on the second end surface, at least a portion of the first side surface, and at least a portion of second side surface of the multilayer body;
a first metal terminal connected to the first outer electrode; and a second metal terminal connected to the second outer electrode; wherein the plurality of inner electrode layers include a first inner electrode layer and a second inner electrode layer; the first inner electrode layer includes a facing portion that faces the second inner electrode layer and an extended portion that extends to the first end surface, to a portion of the first side surface, and to a portion of the second side surface, respectively; the second inner electrode layer includes a facing portion that faces the first inner electrode layer and an extended portion that extends to the second end surface, to a portion of the first side surface, and to a portion of the second side surface, respectively; the multilayer ceramic electronic component body is disposed such that one of the first side surface and the second side surface faces a mounting surface of a mounting board, and such that the first inner electrode layer and the second inner electrode layer are perpendicular or substantially perpendicular to the mounting surface; and a distance between an end of the first outer electrode on the one of the first side surface and the second side surface and an end of the second outer electrode on the one of the first side surface and the second side surface is in a range from about 1.8% to about 31.3% with respect to a length dimension l of the multilayer ceramic electronic component body in a direction connecting the first end surface and the second end surface of the multilayer ceramic electronic component body.

2 . The multilayer ceramic electronic component according to claim 1 , wherein the distance between the end of the first outer electrode on the one of the first and second side surfaces and the end of the second outer electrode on the one of the first and second side surfaces is in the range from about 3.1% to about 31.3% of the length dimension l of the multilayer ceramic electronic component body in the direction connecting the first and second end surfaces of the multilayer ceramic electronic component body.

3 . The multilayer ceramic electronic component according to claim 1 , wherein two or more of the multilayer ceramic electronic component bodies are spaced apart from each other.

4 . The multilayer ceramic electronic component according to claim 3 , wherein
the first metal terminal extends between the respective first outer electrodes of the two or more multilayer ceramic electronic component bodies; and the second metal terminal extends between the respective second outer electrodes of the two or more multilayer ceramic electronic component bodies.

5 . The multilayer ceramic electronic component according to claim 1 , wherein
the first and second metal terminals each include a terminal body and a plating film provided on a surface of the terminal body; and the terminal body is made of an oxygen free Cu-based alloy having a high thermal conductivity.

6 . The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body, the first and second outer electrodes, and at least portions of the first and second metal terminals are covered by a cover material.

7 . The multilayer ceramic electronic component according to claim 6 , wherein the cover material includes a thermosetting epoxy resin.

8 . The multilayer ceramic electronic component according to claim 1 , wherein
the first metal terminal includes:
a first joining portion connected to the first outer electrode and facing the one of the first and second side surfaces;
a first extending portion connected to the first joining portion and extending away from the multilayer ceramic electronic component body in a direction parallel or substantially parallel to the one of the first and second side surfaces;
a second extending portion connected to the first extending portion and extending toward the mounting surface of the mounting board to provide a gap between the one of the first and second side surfaces and the mounting surface; and
a first mounting portion connected to the second extending portion, extending parallel or substantially parallel to the mounting surface of the mounting board, and structured to be mounted on the mounting board; and
the second metal terminal includes:
a second joining portion connected to the second outer electrode and facing the one of the first and second side surfaces;
a third extending portion connected to the second joining portion and extending away from the multilayer ceramic electronic component body in a direction perpendicular or substantially parallel to the one of the first and second side surfaces;
a fourth extending portion connected to the third extending portion and extending toward the mounting surface of the mounting board to provide a gap between the one of the first and second side surfaces and the mounting surface; and
a second mounting portion connected to the fourth extending portion, extending parallel or substantially parallel to the mounting surface of the mounting board, and structured to be mounted on the mounting board.

9 . The multilayer ceramic electronic component according to claim 8 , wherein
the first joining portion of the first metal terminal has a length corresponding to a length of the first outer electrode on the one of the first and second side surfaces; and the second joining portion of the second metal terminal has a length corresponding to a length of the second outer electrode on the one of the first and second side surfaces.

10 . The multilayer ceramic electronic component according to claim 1 , wherein the plurality of ceramic layers are made of BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 .

11 . The multilayer ceramic electronic component according to claim 1 , wherein a thickness of each of the plurality of ceramic layers is in a range from about 0.5 μm to about 10.0 μm.

12 . The multilayer ceramic electronic component according to claim 1 , wherein each of the first and second outer electrodes includes an underlying electrode layer and a plating layer arranged in that order from the multilayer body.

13 . The multilayer ceramic electronic component according to claim 12 , wherein the underlying electrode layer is a baked layer including glass and metal.

14 . The multilayer ceramic electronic component according to claim 13 , wherein a thickness of the baked layer is in a range from about 10 μm to about 50 μm.

Assignees

• Murata Manufacturing Co

Inventors

• Itamochi Masakazu

Classifications

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/38 Primary

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title