Stable Power Capacitors by Thermoelectric Cooling

Patent metadata

Field	Value
Publication number	US-2018368293-A1
Application number	US-201815972988-A
Country	US
Kind code	A1
Filing date	May 7, 2018
Priority date	Jun 20, 2017
Publication date	Dec 20, 2018
Grant date	—

Abstract

Provided is an electronic module comprising at least one electronic component. A thermoelectric cooler is in thermal contact with the electronic component. A temperature controller is capable of determining a device temperature of the electronic component is provided and capable of providing current to the thermoelectric cooler proportional to a deviation of the device temperature from an optimal temperature range.

First claim

1 . An electronic module comprising:
at least one electronic component; a thermoelectric cooler in thermal contact with said electronic component; a temperature controller capable of determining a device temperature of said electronic component and capable of providing current to said thermoelectric cooler proportional to a deviation of said device temperature from an optimal temperature range.

2 . The electronic module of claim 1 wherein at least one said electronic component is a capacitor.

3 . The electronic module of claim 2 wherein said capacitor is a multilayered ceramic capacitor.

4 . The electronic module of claim 2 wherein said capacitor is an electrolytic capacitor.

5 . The electronic module of claim 2 wherein said capacitor is a film capacitor.

6 . The electronic module of claim 4 wherein said electrolytic capacitor comprises at least one channel with at least one said thermoelectric cooler in at least one said channel.

7 . The electronic module of claim 6 wherein at least one said channel is a mandrel.

8 . The electronic module of claim 1 comprising multiple electronic components in thermal contact with said thermoelectric cooler.

9 . The electronic module of claim 1 comprising multiple thermoelectric coolers in thermal contact with said electronic component.

10 . The electronic module of claim 1 comprising multiple electronic components.

11 . The electronic module of claim 10 wherein each said electronic component of said electronic components is a multi-layered ceramic capacitor.

12 . The electronic module of claim 1 wherein said temperature is determined by a method selected from direct and predictive.

13 . The electronic module of claim 1 wherein said temperature controller comprises a temperature sensor selected from the group consisting of a varistor, a resistive temperature detector, a thermistor, an infrared detector, a bi-metallic sensor, a silicone diode, a semiconductor with temperature sensitive voltage vs. current, a thermocouple and an optical sensor.

14 . The electronic module of claim 1 wherein said current provided to said thermoelectric cooler proportionally lowers said device temperature.

15 . The electronic module of claim 1 wherein said current provided to said thermoelectric cooler proportionally raises said device temperature.

16 . The electronic module of claim 1 further comprising a circuit board.

17 . The electronic module of claim 16 wherein at least a portion of said temperature controller is mounted to said circuit board.

18 . The electronic module of claim 16 wherein said circuit board comprises an inorganic material selected from the group consisting of a ceramic; G10; an FR material; a Composite Epoxy Material (CEM), insulated metal substrate, and flexible substrate.

19 . The electronic module of claim 18 wherein said circuit board comprises a material selected from the group consisting of alumina; aluminum nitride; silicon nitride and beryllium oxide.

20 . The electronic module of claim 18 wherein said material is selected from the group consisting of organic materials FR 1, FR 2, FR 3, FR 4, FR 5, FR 6, CEM 1, CEM 2, CEM 3, CEM 4, CEM 5 or polyimide.

21 . The electronic module of claim 16 wherein said electronic component is between said circuit board and said thermoelectric cooler.

22 . The electronic module of claim 16 wherein said thermoelectric cooler is between said circuit board and said electronic component.

23 . The electronic module of claim 1 further comprising an overmolding over at least a portion of said electronic module.

24 . The electronic module of claim 1 further comprising a heat sink in thermal contact with said thermoelectric cooler.

25 . The electronic module of claim 24 wherein said heat sink is in thermal contact with said thermoelectric cooler opposite said electronic component.

26 . A method for controlling a device temperature of a capacitor comprising:
forming an electronic module comprising at least one capacitor wherein said capacitor comprises an optimal temperature range; placing a thermoelectric cooler in thermal contact with said capacitor; and providing a thermal controller comprising a temperature sensor capable of measuring said device temperature of said capacitor and providing a current to said thermoelectric cooler wherein said current is proportional to a deviation of said device temperature from said optimal temperature range.

27 . The method for controlling a device temperature of a capacitor of claim 26 wherein said capacitor is a multilayered ceramic capacitor.

28 . The method for controlling a device temperature of a capacitor of claim 26 wherein said capacitor is an electrolytic capacitor.

29 . The method for controlling a device temperature of a capacitor of claim 28 wherein said capacitor is a film capacitor.

30 . The method for controlling a device temperature of a capacitor of claim 28 wherein said electrolytic capacitor comprises at least one channel with at least one said thermoelectric cooler in at least one said channel.

31 . The method for controlling a device temperature of a capacitor of claim 29 wherein at least one said channel is a mandrel.

32 . The method for controlling a device temperature of a capacitor of claim 26 comprising multiple electronic components in thermal contact with said thermoelectric cooler.

33 . The method for controlling a device temperature of a capacitor of claim 26 comprising multiple thermoelectric coolers in thermal contact with said electronic component.

34 . The method for controlling a device temperature of a capacitor of claim 26 wherein said electronic module comprises multiple multi-layered ceramic capacitors.

35 . The method for controlling a device temperature of a capacitor of claim 26 wherein said temperature is determined by a method selected from direct and predictive.

36 . The method for controlling a device temperature of a capacitor of claim 26 wherein said temperature controller comprises a temperature sensor selected from the group consisting of a varistor, a resistive temperature detector, a thermistor, an infrared detector, a bi-metallic sensor, a silicone diode, a semiconductor with temperature sensitive voltage vs. current, a thermocouple and an optical sensor.

37 . The method for controlling a device temperature of a capacitor of claim 26 wherein said current provided to said thermoelectric cooler proportionally lowers said device temperature.

38 . The method for controlling a device temperature of a capacitor of claim 26 wherein said current provided to said thermoelectric cooler proportionally raises said device temperature.

39 . The method for controlling a device temperature of a capacitor of claim 26 wherein said electronic module further comprising a circuit board.

40 . The method for controlling a device temperature of a capacitor of claim 39 wherein at least a portion of said temperature controller is mounted to said circuit board.

41 . The method for controlling a device temperature of a capacitor of claim 40 wherein said thermoelect

Assignees

• Kemet Electronics Corp

Inventors

• Bultitude John
• Mcconnell John

Classifications

• H01G9/14

  Structural combinations {or circuits} for modifying, or compensating for, electric characteristics of electrolytic capacitors · CPC title

• H01G11/18

  against thermal overloads, e.g. heating, cooling or ventilating · CPC title

• H05K7/20918

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• H05K7/20945 Primary

  Thermal management, e.g. inverter temperature control · CPC title

• H01G4/258

  Temperature compensation means · CPC title