Thermally conductive polysiloxane compositions

Patent metadata

Field	Value
Publication number	US-12509557-B2
Application number	US-202017622273-A
Country	US
Kind code	B2
Filing date	Jun 24, 2020
Priority date	Jun 26, 2019
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler and (B) one or more compounds selected from an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) includes (A-1) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of from 50 μm to 150 μm and (A-2) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of 10 μm or more but less than 50 μm in an amount of from 20% by mass to 100% by mass relative to the total amount of component (A); and the content ratio of component (A-1) to component (A-2) is from 50:50 to 95:5 on a mass basis.

First claim

The invention claimed is:

1 . A thermally conductive polysiloxane composition containing (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane,
wherein the component (A) comprises, based on the total mass of the component (A): 20 to 60 mass % of (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of not less than 50 μm and not more than 150 μm, 2 to 25 mass % of (A-2) round, indefinite-shaped, or polyhedral aluminum nitride particles having an average particle diameter of not less than 13 μm and not more than 35 μm, 20 to 35 mass % of (A-3a) inorganic particles having an average particle diameter of not less than 1 μm and less than 10 μm, and 10 to 25 mass % of (A-3b) inorganic particles having an average particle diameter of not less than 0.15 μm and not more than 0.9 μm, wherein the content ratio of the component (A-1) to the component (A-2) on a mass basis is 50:50 to 95:5, and wherein the total of the components (A-1), (A-2), (A-3a), and (A-3b) represents 80 to 100 mass % of the total mass of the component (A).

2 . The thermally conductive polysiloxane composition according to claim 1 , wherein the inorganic particles of the components (A-3a) and (A-3b) are at least one member selected from the group consisting of silicon nitride particles, aluminum nitride particles and alumina particles, respectively.

3 . The thermally conductive polysiloxane composition according to claim 1 , further comprising (C) a polyorganosiloxane containing one or more aliphatic unsaturated groups per molecule, (D) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and a (E) platinum catalyst.

4 . The thermally conductive polysiloxane composition according to claim 2 , further comprising (C) a polyorganosiloxane containing one or more aliphatic unsaturated groups per molecule, (D) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and (E) a platinum catalyst.

5 . The thermally conductive polysiloxane composition according to claim 1 , wherein the component (A) is 20 to 42 mass % of the component (A-1) based on the total mass of the component (A).

6 . The thermally conductive polysiloxane composition according to claim 1 , wherein the component (A) is 25 to 35 mass of the component (A-3a) based on the total mass of the component (A).

7 . The thermally conductive polysiloxane composition according to claim 1 , wherein the component (A-2) has an oil absorption of 5 to 40 g/100 g as measured by a boiled linseed oil method in accordance with JIS K5101-13-2.

8 . The thermally conductive polysiloxane composition according to claim 1 , wherein the component (B) comprises the alkoxysilyl group-containing compound, and the composition further comprises (F) a condensation catalyst.

9 . A heat dissipation material comprising the thermally conductive polysiloxane composition according to claim 1 .

Assignees

• Momentive Performance Mat Jp

Inventors

• Sakamoto Atsushi
• Conte Sean

Classifications

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/282

  Binary compounds of nitrogen with aluminium · CPC title

• C08K3/28

  Nitrogen-containing compounds · CPC title

• B01J23/42

  Platinum · CPC title