Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of ciruit module
US-2015138740-A1 · May 21, 2015 · US
US11142644B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11142644-B2 |
| Application number | US-201816481086-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 25, 2018 |
| Priority date | Jan 27, 2017 |
| Publication date | Oct 12, 2021 |
| Grant date | Oct 12, 2021 |
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The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
Opening claim text (preview).
The invention claimed is: 1. A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule; (D1) a linear polyorganohydrogensiloxane represented by the following general formula (4): wherein: R 7 is a hydrogen atom, R 8 is each independently a monovalent hydrocarbon group having no aliphatic unsaturated bond and having 1 to 12 carbon atoms, and f is 1 to 200; (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the following general formula (5): R 9 g R 10 h SiO ({4−(g+h)}/2) (5) wherein: R 9 is each independently a monovalent hydrocarbon group having no aliphatic unsaturated bond and having 1 to 12 carbon atoms, R 10 is a hydrogen atom, g is an integer of 0 to 2, h is an integer of 1 or 2, and g+h is an integer of 1 to 3, with the proviso that a case in which g is 1 and h is 1 is excluded; and (E) a platinum catalyst, wherein (D2) is a polyorganohydrogensiloxane comprising a R 11 2 HSiO 1/2 unit, wherein R 11 is synonymous with R 9 , and a SiO 4/2 unit, and having at least three hydrogen atoms bonded to silicon atoms per molecule, wherein a ratio ((H D1 +H D2 )/Vi C ) of a sum (H D1 +H D2 ) of a number H D1 of hydrogen atoms bonded to silicon atoms of (D1) and a number H D2 of hydrogen atoms bonded to silicon atoms of (D2) to a number Vi C of the alkenyl groups of (C) is 0.85 or less, and wherein a ratio of H D1 :H D2 is in a range of from 9:1 to 8:2. 2. The thermally conductive polysiloxane composition according to claim 1 , wherein (B) is a siloxane compound represented by the following general formula (1): wherein: R 1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R 2 is a linear organosiloxy group represented by the following general formula (2): wherein: R 4 is each independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a group selected from the group consisting of a methyl group, a vinyl group, and R 1 , and d is an integer of 2 to 500; X is each independently a divalent hydrocarbon group having 2 to 10 carbon atoms, a and b are each independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and R 3 is each independently a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom. 3. The thermally conductive polysiloxane composition according to claim 1 , wherein (C) is a linear polyorganosiloxane represented by the following general formula (3): wherein: R 5 is each independently an alkenyl group having 2 to 6 carbon atoms, R 6 is each independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, and e is a number such that the viscosity of 0.01 to 50 Pa·s at 23° C.
Organics · CPC title
Silica · CPC title
Polysiloxanes · CPC title
containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title
of aluminium · CPC title
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