Sensor element and method for manufacturing a sensor element

Patent metadata

Field	Value
Publication number	US-12504335-B2
Application number	US-202017637768-A
Country	US
Kind code	B2
Filing date	Sep 16, 2020
Priority date	Nov 20, 2019
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.

First claim

The invention claimed is:

1 . A sensor element comprising:
a carrier comprising an electrically insulating material, a top side and a bottom side; an NTC thermistor arranged on the top side of the carrier; at least two first electrodes arranged on the top side of the carrier, wherein a respective one of the first electrodes comprises a first area configured for electrically contacting the sensor element by a wire bonding or soldering, wherein the respective one comprises a second area configured for electrically contacting the NTC thermistor by soldering, wherein the first area and the second area are interconnected by a web-shaped connecting area; at least one second electrode arranged over an entire surface on the bottom side of the carrier, wherein the second electrode is directly applicable to a conductor path of a power module using conventional assembly and connection technology; and a protective layer arranged at least around the NTC thermistor, wherein the protective layer completely envelops the NTC thermistor and comprises a polymer, wherein the NTC thermistor is an SMD NTC thermistor, wherein the sensor element is configured for direct integration in an electrically insulating manner, and wherein the sensor element is configured to measure a temperature.

2 . The sensor element according to claim 1 , wherein the sensor element is configured for the direct integration onto the conductor path of the power module in the electrically insulating manner.

3 . The sensor element according to claim 1 , wherein the electrically insulating material of the carrier comprises a ceramic based on AlN, Si 3 N 4 , Al 2 O 3 , low temperature cofired ceramics (LTCC) or Zirconia Toughened Aluminum Oxide (ZTA) materials.

4 . The sensor element according to claim 1 , wherein coefficients of thermal expansion of a carrier material and a material of the NTC thermistor are matched.

5 . The sensor element according to claim 1 , wherein the respective one comprises a plurality of layers, and wherein the respective one comprises Cu, Ni, Pd and/or Au.

6 . The sensor element according to claim 5 , wherein at least one layer of the respective one is a thick film, and wherein at least one further layer of the respective one is a thin film.

7 . The sensor element according to claim 1 , wherein the respective one is arranged directly on the top side of the carrier, wherein the NTC thermistor is arranged directly on the respective one, wherein the NTC thermistor has a metallization located on a top side of the NTC thermistor, and wherein the metallization forms another one of the two first electrodes.

8 . The sensor element according to claim 7 , wherein the NTC thermistor is a chip NTC thermistor.

9 . The sensor element according to claim 7 , wherein the metallization is configured for electrically contacting of the sensor element by wire bonding.

10 . The sensor element according to claim 7 , wherein the metallization has at least one layer containing nickel.

11 . The sensor element according to claim 10 , wherein the layer is arranged directly at a ceramic base body of the NTC thermistor.

12 . The sensor element according to claim 10 , wherein the layer further comprises a proportion of vanadium.

13 . The sensor element according to claim 7 , wherein the metallization comprises a plurality of layers arranged directly one above the other.

14 . The sensor element according to claim 1 , wherein the second electrode is multi-layered and comprises Cu, Ni, Pd and/or Au, or wherein the second electrode comprises at least one layer of Ag.

15 . The sensor element according to claim 14 , wherein the second electrode is arranged such that a free edge is formed on the bottom side of the carrier.

16 . The sensor element according to claim 14 , wherein the second electrode has a metallization on a top side.

17 . The sensor element according to claim 14 , further comprising at least one adhesion promoting layer arranged between the respective one and the carrier and/or between the second electrode and the carrier.

18 . A method for manufacturing the sensor element according to claim 1 , the method comprising:
providing a carrier material for forming the carrier; applying the at least two first electrodes to a top side of the carrier material; applying the at least one second electrode to the bottom side of the carrier material; and arranging the NTC thermistor on the top side of the carrier material after applying the two first electrodes, wherein the respective first electrode has a multilayer structure and comprises Cu, Ni, Pd and/or Au, wherein a bottom layer of the respective first electrode comprises Cu, wherein the bottom layer is a layer of the respective first electrode that is formed directly on the top side of the carrier, and wherein the NTC thermistor is soldered onto a partial area of the at least two first electrodes.

19 . The method according to claim 18 , wherein the first electrodes are applied to the top side of the carrier material by a combined process of sputtering, CVD process, PVD process and/or electrodeposition.

20 . The method according to claim 18 , further comprising forming a metallization on the bottom side of the second electrode, wherein the metallization is applied by a CVD process, a PVD process and/or by electrodeposition.

21 . A method for manufacturing the sensor element according to claim 1 , the method comprising:
providing a carrier material for forming the carrier; applying at least a first electrode on a top side of the carrier material; applying the at least one second electrode to the bottom side of the carrier material; and arranging the NTC thermistor on the first electrode, wherein the NTC thermistor is applied to a partial area of the first electrode, and wherein the NTC thermistor has a metallization which functions as a further first electrode, wherein the NTC thermistor is a chip NTC thermistor.

22 . The sensor element according to claim 1 , wherein the second electrode comprises at least one layer of Ag.

23 . A sensor element comprising:
a carrier comprising an electrically insulating material, a top side and a bottom side; an NTC thermistor arranged on the top side of the carrier; and at least two first electrodes arranged on the top side of the carrier, wherein one of the first electrodes is arranged directly on the top side of the carrier, wherein the NTC thermistor is arranged directly on a respective one of the first electrodes, wherein the NTC thermistor has a metallization located on a top side of the NTC thermistor, wherein the metallization forms another one of the two first electrodes, wherein the respective one of the first electrodes covers an entire top surface of the carrier, wherein the sensor element is configured for direct integration in an electrically insulating manner, and wherein the sensor element is configured to measure a temperature.

Assignees

• Tdk Electronics Ag

Inventors

• Weidenfelder Anke
• Ihle Jan
• Stendel Thomas
• Kirsten Lutz Heiner

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H01C7/041

  formed with two or more layers · CPC title

• H05K2203/049

  Wire bonding · CPC title