Thermistor mounting apparatus and thermistor component

Patent metadata

Field	Value
Publication number	US-10056175-B2
Application number	US-201615150432-A
Country	US
Kind code	B2
Filing date	May 10, 2016
Priority date	Jun 4, 2015
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

In order to realize a thermistor on a base substrate without restricting the layout of a wiring layer, a thermistor mounting apparatus is provided, the thermistor mounting apparatus including a base substrate, and a thermistor component provided over the base substrate, in which the thermistor component has an insulating substrate, an electrode provided over the insulating substrate, and a thermistor provided over the insulating substrate and electrically connected to the electrode.

First claim

What is claimed is:

1. A thermistor mounting apparatus, comprising:
a base substrate; and
a thermistor component provided over the base substrate, the thermistor component having:
an insulating substrate;
an electrode provided over the insulating substrate; and
a thermistor provided over the insulating substrate and electrically connected to the electrode,
wherein a wiring layer is formed on the base substrate, and the insulating substrate is adhered on top of the wiring layer such that the insulating substrate is between the thermistor with the electrode, and the wiring layer.

2. The thermistor mounting apparatus according to claim 1 , further comprising an electronic component provided in a region different from the thermistor component over the base substrate.

3. The thermistor mounting apparatus according to claim 2 , wherein the electronic component is provided in a region different from the thermistor component over the wiring layer.

4. The thermistor mounting apparatus according to claim 2 , further comprising a plurality of the electronic components, wherein the thermistor component is provided corresponding to a part of one of the plurality of the electronic components.

5. The thermistor mounting apparatus according to claim 1 , wherein an area of the insulating substrate of the thermistor component is smaller than an area of the base substrate.

6. A thermistor mounting apparatus comprising:
a base substrate; and
a thermistor component provided over the base substrate, the thermistor component having:
an insulating substrate;
an electrode provided over the insulating substrate; and
a thermistor provided over the insulating substrate and electrically connected to the electrode;
wherein the thermistor component further has a thermal conductive layer that is provided between the insulating substrate and the base substrate, the thermal conductive layer having thermal conductivity higher than that of the insulating substrate.

7. The thermistor mounting apparatus according to claim 6 , wherein the thermistor component further has an adhesive layer provided between the thermal conductive layer and the base substrate, and adhesive properties of the thermal conductive layer to the adhesive layer are higher than adhesive properties of the insulating substrate to the adhesive layer.

8. The thermistor mounting apparatus according to claim 7 , wherein the thermistor component is constituted of a material having a melting point higher than that of the adhesive layer, and further has a securing portion for securing the thermistor to the electrode.

9. A thermistor mounting apparatus, comprising:
a base substrate;
a wiring layer provided over the base substrate; and
a thermistor component provided over the wiring layer, the thermistor component having:
an insulating substrate;
an electrode provided over the insulating substrate; and
a thermistor provided over the insulating substrate and electrically connected to the electrode,
wherein the insulating substrate is adhered on top of the wiring layer such that the insulating substrate is between the thermistor with the electrode, and the wiring layer.

10. A thermistor component, comprising:
an insulating substrate;
an electrode provided over the insulating substrate;
a thermistor provided over the insulating substrate and electrically connected to the electrode; and
an adhesive layer provided under the insulating substrate,
wherein a wiring layer is formed on a base substrate, and the insulating substrate is adhered on top of the wiring layer such that the insulating substrate is between the thermistor with the electrode, and the wiring layer.

11. The thermistor component according to claim 10 , further comprising a securing portion being formed of a material having a melting point higher than that of the adhesive layer, and securing the thermistor to the electrode.

12. The thermistor component according to claim 10 , further comprising a thermal conductive layer being provided between the adhesive layer and the insulating substrate, and having thermal conductivity higher than that of the insulating substrate.

Assignees

• Fuji Electric Co Ltd

Inventors

• Yamamoto Sayaka
• Ogawa Shogo

Classifications

• H05K2201/049

  PCB for one component, e.g. for mounting onto mother PCB · CPC title

• H05K1/0268

  for electrical inspection or testing · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C7/008 Primary

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title