Thermistor film and method of depositing the same
US-2020166415-A1 · May 28, 2020 · US
formed with two or more layers
formed with two or more layers · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C7/041 |
| Official title | {formed with two or more layers} |
| Display label | formed with two or more layers |
| Total patents | 126 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 10 |
| 2017 | 17 |
| 2018 | 12 |
| 2019 | 7 |
| 2020 | 9 |
| 2021 | 7 |
| 2022 | 13 |
| 2023 | 6 |
| 2024 | 17 |
| 2025 | 12 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic Component for Limiting the Inrush Current, and Use of an Electronic Component
US-2020118718-A1 · Apr 16, 2020 · US
Hybrid device structures including negative temperature coefficient/positive temperature coefficient device
US-10446355-B2 · Oct 15, 2019 · US
Multi-Layered Component and Method for Producing a Multi-Layered Component
US-2019287702-A1 · Sep 19, 2019 · US
Alumina diffusion barrier for sensing elements
US-10371581-B2 · Aug 6, 2019 · US
Sensor device
US-2019204251-A1 · Jul 4, 2019 · US
Ceramic electronic component and manufacturing method therefor
US-10304630-B2 · May 28, 2019 · US
Metal nitride material for thermistor, method for producing same, and film type thermistor sensor
US-10304597-B2 · May 28, 2019 · US
Electronic component
US-2019098761-A1 · Mar 28, 2019 · US
Alumina diffusion barrier for sensing elements
US-2018348062-A1 · Dec 6, 2018 · US
Hybrid device structures including negative temperature coefficient/positive temperature coefficient device
US-2018315575-A1 · Nov 1, 2018 · US
Thin-film resistor and method for producing the same
US-10115504-B2 · Oct 30, 2018 · US
Heat-sensitive resistance device
US-10072989-B2 · Sep 11, 2018 · US
Method of manufacturing electronic component, and electronic component
US-10074465-B2 · Sep 11, 2018 · US
Metal nitride material for thermistor, method for producing same, and film-type thermistor sensor
US-10054497-B2 · Aug 21, 2018 · US
Thermistor element
US-10037838-B2 · Jul 31, 2018 · US
Temperature sensor for tracking body temperature based on printable nanomaterial thermistor
US-10034609-B2 · Jul 31, 2018 · US
Electronic component
US-9972426-B2 · May 15, 2018 · US
Ceramic electronic component
US-9959975-B2 · May 1, 2018 · US
Temperature sensor
US-9891117-B2 · Feb 13, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C7/041?
- CPC H01C7/041 is the Cooperative Patent Classification code for “formed with two or more layers.”
- How many patents are filed under CPC H01C7/041 (formed with two or more layers)?
- Our database includes 126 publications tagged with this CPC code.
- Is patent activity under CPC H01C7/041 growing?
- Publication counts under this code: 17 in 2024 vs 12 in 2025 (latest complete years).