Electronic device including wire

Patent metadata

Field	Value
Publication number	US-12500970-B2
Application number	US-202318394663-A
Country	US
Kind code	B2
Filing date	Dec 22, 2023
Priority date	Oct 25, 2022
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

An electronic device including wires is provided. The electronic device, which includes multiple wires through which direct current (DC) power and at least one radio frequency (RF) signal are transmitted, includes an RF transmitter configured to transmit the RF signal, and a power transmitter configured to transmit the DC power. The power transmitter includes a first power conductor including a conductive material, a second power wire including a conductive material and electrically spaced apart from the first power conductor in a first direction, a power conductor disposed between the first power conductor and the second power wire in parallel with the second power wire and electrically spaced apart from the second power wire, and at least one first via electrically connecting the first power conductor and the power conductor.

First claim

What is claimed is:

1 . An electronic device comprising:
a first printed circuit board; a second printed circuit board; and a flexible printed circuit board (FPCB) providing electrical connection between the first and second circuit board, wherein the FPCB comprises: an RF signal circuit configured to transmit or receive at least one RF signal; and a power circuit configured to transmit electric power, wherein the power circuit comprises:
a first power conductor comprising a conductive material,
a second power conductor comprising a conductive material and electrically spaced apart from the first power conductor in a first direction,
a third power conductor disposed between the first power conductor and the second power conductor in parallel with the second power conductor and electrically spaced apart from the second power conductor in the first direction, and
at least one first via electrically connecting the first power conductor and the third power conductor.

2 . The electronic device of claim 1 ,
wherein the second power conductor and a power conductor wire are configured to form a capacitor having a capacitance value, wherein the first via is configured to form an inductor having an inductance value when the electric power is transmitted through the power circuit, and wherein the capacitor and inductor are configured to filter one or more frequency band of the RF signal when the RF signal is transmitted or received through the RF signal circuit.

3 . The electronic device of claim 2 , wherein the capacitance value is determined by a width of the second power conductor and a distance between the second power conductor and the third power conductor.

4 . The electronic device of claim 2 ,
wherein the power circuit comprises a plurality of the first vias, and wherein the inductance is determined by an arrangement interval and a number of the plurality of the first vias.

5 . The electronic device of claim 4 ,
wherein the first vias are arranged in a plurality of rows in a direction in which the first power conductor extends, and wherein the capacitance value is determined by a number of the rows of the first vias.

6 . The electronic device of claim 1 ,
wherein the RF signal circuit comprises:
a first conductor having one surface oriented in the first direction;
a second conductor located in parallel to the first conductor in the first direction with respect to the first conductor; and
a plurality of second vias electrically connecting the first conductor and the second conductor, and
wherein the first conductor, the second conductor and the plurality of second vias define a substrate-integrated waveguide.

7 . The electronic device of claim 1 ,
wherein the RF signal circuit includes a first RF signal circuit and a second RF circuit, and wherein the power circuit is located between the first RF signal circuit and the second RF signal circuit.

8 . The electronic device of claim 1 ,
wherein the FPCB comprises:
a first layer having one surface oriented in the first direction,
a second layer disposed in parallel to the first layer in the first direction with respect to the first layer,
a third layer disposed in parallel to the second layer in the first direction with respect to the second layer, and
an insulating material comprising an electrically insulating and flexible material and disposed between adjacent ones of the first layer, the second layer, and the third layer,
wherein the first power conductor is disposed on the first layer, wherein the second power conductor is disposed on the third layer, and wherein the power conductor is disposed on the second layer.

9 . The electronic device of claim 8 ,
wherein the RF signal circuit comprises:
a first conductor disposed side by side with the first power conductor on the first layer,
a second conductor disposed side by side with the power conductor on the second layer,
a third conductor disposed side by side with the power conductor on the third layer,
a plurality of second vias electrically connecting an edge of the first conductor and an edge of the second conductor, and
a plurality of third vias electrically connecting an edge of the third conductor and the edge of the second conductor,
wherein the first conductor, the second conductor, and the second vias define a first substrate-integrated waveguide, and wherein the second conductor, the third conductor, and the third vias define a second substrate-integrated waveguide.

10 . The electronic device of claim 8 , wherein the FPCB comprises a fourth layer disposed between the first layer and the second layer.

11 . The electronic device of claim 10 , wherein the power circuit further comprises a fourth wire disposed on the fourth layer and comprising plurality of through holes through which the first via pass.

12 . The electronic device of claim 1 , wherein the third power conductor comprises at least one segment connected to the at least one first via.

13 . A flexible printed circuit board (FPCB) for an electronic device, the FPCB comprising:
a radio frequency (RF) signal circuit configured to transmit an RF signal; and a power circuit configured to transmit electric power, wherein the power circuit comprises:
a first power conductor comprising a conductive material,
a second power conductor comprising a conductive material and electrically spaced apart from the first power conductor in a first direction,
a third power conductor disposed between the first power conductor and the second power conductor in parallel with the second power conductor and electrically spaced apart from the second power conductor, and
at least one first via electrically connecting the first power conductor and the third power conductor.

14 . The flexible printed circuit board of claim 13 ,
wherein the second power conductor and the third power conductor are configured form a capacitor having a capacitance value, wherein the first via is configured to form an inductor having an inductance value with the first power conductor and the third power conductor, and wherein the capacitor and inductor are configured to filter one or more frequency band of the RF signal when the RF signal is transmitted or received through the RF signal circuit.

15 . The flexible printed circuit board of claim 14 , wherein the capacitance value is determined by a width of the second power conductor and a distance between the second power conductor and a third power wire.

16 . The flexible printed circuit board of claim 14 , further comprising:
a power transmitter comprising a plurality of the first vias, wherein the inductance is determined by an arrangement interval and a number of the plurality of the first vias.

17 . The flexible printed circuit board of claim 16 ,
wherein the first vias are arranged in a plurality of rows in a direction in which the first power conductor extends, and wherein the capacitance value is determined by a number of the rows of the first vias.

18 . The flexible printed circuit board of claim 13 , wherein the RF signal circuit comprises:
a first conductor having one surface oriented in the first direction; a second conductor located in parallel to the first conductor in the first direction with respect to the first conductor; and a substrate-integrated waveguide comprising a plurality of second vias located at edges of the first conductor and the second conductor and electrically connecting the first conductor and the second conductor.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Bae Bumhee
• Kim Myunghoi
• Kim Minseok
• Kim Younho
• Shim Jongwan
• Yang Kwangmo
• Cheon Jeongnam

Classifications

• H04M1/0277

  for a printed circuit board assembly · CPC title

• H01P3/12

  Hollow waveguides (H01P3/20 takes precedence) · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K2201/037

  Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides · CPC title