Flexible printed circuit board

Patent metadata

Field	Value
Publication number	US-10624209-B2
Application number	US-201716077070-A
Country	US
Kind code	B2
Filing date	Feb 6, 2017
Priority date	Feb 26, 2016
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.

First claim

The invention claimed is:

1. A flexible printed circuit board, comprising:
a first substrate part comprising a first signal line;
a second substrate part comprising a second signal line parallel to the first signal line,
wherein the first substrate part and the second substrate part are disposed on a same plane with a shielding part therebetween;
a first dielectric layer;
a second dielectric layer disposed to be spaced a first predetermined distance from the first dielectric layer in a vertical direction;
a pair of first side grounds laminated to be spaced a second predetermined distance from each other on a bottom surface of the first dielectric layer;
a pair of second side grounds laminated to be spaced a third predetermined distance from each other on a plane of the second dielectric layer;
a first central ground disposed between the pair of first side grounds and laminated on the bottom surface of the first dielectric layer;
a second central ground disposed between the pair of second side grounds and laminated on the plane of the second dielectric layer,
wherein the first signal line and the second signal line are disposed with the first central ground and the second central ground therebetween,
wherein the first substrate part includes one of the pair of first side grounds and one of the pair of second side grounds, and the second substrate part includes another of the pair of first side grounds and another of the pair of second side grounds, and
wherein each of the pair of first side grounds and each of the pair of second side grounds are respectively coupled to each other by using a coupling part as a medium, the coupling part being a single layer and consisting of dielectric material.

2. The flexible printed circuit board of claim 1 , wherein the first signal line is disposed between one of the pair of second side grounds and the second central ground, and formed on the plane of the second dielectric layer, and
the second signal line is disposed between one of the pair of first side grounds and the first central ground, and formed on the bottom surface of the first dielectric layer.

3. The flexible printed circuit board of claim 2 , wherein a first ground layer is laminated on a plane of the first dielectric layer,
a second ground layer is laminated on a bottom surface of the second dielectric layer, and
facing surfaces of the first dielectric layer and the second dielectric layer, the first central ground and the second central ground are respectively coupled to each other by using the coupling part as the medium.

4. The flexible printed circuit board of claim 2 ,
wherein a first ground layer is laminated on a plane of the first dielectric layer,
a second ground layer is laminated on a bottom surface of the second dielectric layer, and
the first central ground and the second central ground are respectively coupled to each other by using the coupling part as the medium, and
wherein an air layer is formed in a space through which the first dielectric layer and the second dielectric layer face each other so that the first signal line and the second signal line are exposed to the air layer.

5. The flexible printed circuit board of claim 1 , further comprising:
a first via hole formed to pass through the first substrate part in a vertical direction;
a second via hole formed to pass through the second substrate part in the vertical direction; and
third and fourth via holes passing through the shielding part in the vertical direction and formed to be spaced a predetermined distance from each other in a width direction.

6. The flexible printed circuit board of claim 5 , wherein the first via hole to the fourth via hole are disposed on a same line in the width direction.

7. The flexible printed circuit board of claim 5 ,
wherein the first via hole and the third via hole are disposed on a same first line in the width direction, the second via hole and the fourth via hole are disposed on a same second line in the width direction,
wherein the flexible printed circuit board further comprises a plurality of first via holes including the first via hole, a plurality of second via holes including the second via hole, a plurality of third via holes including the third via hole, and a plurality of fourth via holes including the fourth via hole,
wherein respective first via holes and third via holes are disposed on a plurality of first lines in the width direction,
wherein respective second via holes and respective fourth via holes are disposed on a plurality of second lines in the width direction, and
wherein respective first lines and respective second lines are formed to alternate with each other.

8. The flexible printed circuit board of claim 1 , wherein a plurality of circular ground holes are formed to be spaced a predetermined distance from each other in a longitudinal direction of the first signal line in a first ground layer disposed on a plane of the first signal line,
a plurality of rectangular ground holes are formed to be spaced a predetermined distance from each other in a longitudinal direction of the second signal line in the first ground layer disposed on a plane of the second signal line,
a plurality of rectangular ground holes are formed to be spaced a predetermined distance from each other in the longitudinal direction of the first signal line in a second ground layer disposed on a bottom surface of the first signal line, and
a plurality of circular ground holes are formed to be spaced a predetermined distance from each other in the longitudinal direction of the second signal line in the second ground layer disposed on a bottom surface of the second signal line.

9. The flexible printed circuit board of claim 1 , wherein a coaxial cable is connected to one end of each of the first signal line and the second signal line.

10. The flexible printed circuit board of claim 9 , wherein another end of each of the first signal line and the second signal line extends in a left and right direction to form a “T” shape.

11. The flexible printed circuit board of claim 10 , wherein a first antenna and a second antenna are respectively coupled to respective ends of the “T” shape that are extended in the left and right direction.

12. The flexible printed circuit board of claim 10 , wherein a first antenna and a second antenna are formed to respectively extend from respective ends of the “T” shape that are extended in the left and right direction.

13. A flexible printed circuit board, comprising:
a first substrate part comprising a first signal line;
a second substrate part comprising a second signal line parallel to the first signal line,
wherein the first substrate part and the second substrate part are disposed on a same plane with a shielding part therebetween;
a first dielectric layer;
a second dielectric layer disposed to be spaced a first predetermined distance from the first dielectric layer in a vertical direction;
a third dielectric layer spaced a second predetermined distance from the second dielectric layer in the vertical direction, wherein the third dielectric layer and the second dielectric layer are disposed with the first dielectric layer therebetween;
a pair of first side grounds laminated to be spaced a third predetermined distance from each other on a plane of the first dielectric layer;
a pair of second side grounds laminated to be spaced a fourth predetermined distance from each other on a bottom surface of the first dielectric layer;
a first central ground disposed between the pair of first side grounds and laminated on the plane of the first dielectric layer; and
a second central ground dis

Assignees

• Gigalane Co Ltd

Inventors

• Kim Ik Soo
• Kim Byung Yeol
• Kim Sang Pil
• Jo Byung Hoon
• Lee Da Yeon
• Koo Hwang Sub
• Kim Hyun Je
• Jung Hee Seok

Classifications

• H05K1/024

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• H05K2201/09236

  Parallel layout · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K1/0221 Primary

  Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines · CPC title