Flexible circuit board and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9615445-B2
Application number	US-201514858652-A
Country	US
Kind code	B2
Filing date	Sep 18, 2015
Priority date	Jun 24, 2015
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.

First claim

What is claimed is:

1. A flexible circuit board comprising:
two copper clad laminates, each comprising an insulating base and an outer circuit layer;
a circuit pattern located between the two copper clad laminates, and comprising a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines; and
two bonding layers, each located between the circuit pattern and a corresponding copper clad laminate, each of the boding layers defining a slot without adhesive therein;
wherein the bonding layers are spaced from the linear signal line by the slots, the slots of the two bonding layers and the two hollow areas of the circuit pattern cooperatively defining an air medium layer enclosing the linear signal line.

2. The flexible circuit board of claim 1 , wherein the slots of the two bonding layers are corresponding to the linear signal line of the circuit pattern.

3. The flexible circuit board of claim 2 , wherein each of the slots has a size no less than a size of the linear signal line of the circuit pattern.

4. The flexible circuit board of claim 3 , wherein each of the slots has a width larger than that of the linear signal line of the circuit pattern, and a length no less than that of the linear signal line.

5. The flexible circuit board of claim 3 , wherein each of the slots has a width equal to a total width of the linear signal line and the two hollow areas of the circuit pattern.

6. The flexible circuit board of claim 1 , wherein the two grounding lines of the circuit pattern are parallel to each other.

7. The flexible circuit board of claim 1 , wherein the two grounding lines is symmetric to each other about the linear signal line of the circuit pattern.

8. The flexible circuit board of claim 1 , wherein the linear signal line is electrically independent from two grounding lines of the circuit pattern.

9. The flexible circuit board of claim 1 , wherein the outer circuit layer comprises a plurality of spaced connecting pads.

10. The flexible circuit board of claim 1 , wherein the insulating base is flexible.

11. The flexible circuit board of claim 1 , further comprising a plurality of conductive holes electrically connecting the outer circuit layers with the grounding lines of the circuit pattern.

12. The flexible circuit board of claim 1 , further comprising two solder resist layers covering corresponding outer circuit layers of the copper clad laminates.

13. A method for manufacturing a flexible circuit board, comprising:
providing two copper clad laminates each comprising a copper foil and an insulating base;
forming a circuit pattern to comprise a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and corresponding grounding lines;
providing two bonding layers each defining a slot without adhesive therein; and
positioning the two bonding layers between the circuit pattern and corresponding copper clad laminates, and laminating the copper clad laminates, the bonding layers and the circuit pattern together to form an air medium layer enclosing the linear signal line.

14. The method of claim 13 , wherein the bonding layers only contact the grounding lines of the circuit pattern, and are spaced from the linear signal line of the circuit pattern.

15. The method of claim 13 , after laminating the copper clad laminates, the bonding layers and the circuit pattern together, further comprising: defining a plurality of conductive holes are in the copper clad laminates and the bonding layers to electrically connect the copper foils of the copper clad laminates with the grounding lines of the circuit pattern.

16. The method of claim 13 , further comprising: etching the copper foils of the two copper clad laminates to form two outer circuit layers of the two copper clad laminates.

17. The method of claim 13 , further comprising: forming two solder resist layers respectively covering the outer circuit layers.

18. The method of claim 13 , further comprising: cutting the linear signal line to be electrically independent from the two grounding lines.

19. The method of claim 13 , wherein the insulating base is flexible.

20. The method of claim 13 , wherein the air medium layer is enclosed by the insulating bases of the copper clad laminates, the bonding layers and the grounding lines of the circuit pattern.

Assignees

• Fukui Prec Component (Shenzhen) Co Ltd
• Hongqisheng Prec Electronics (Qinhuangdao) Co Ltd
• Zhen Ding Tech Co Ltd
• Garuda Tech Co Ltd

Inventors

• Hu xian-qin
• Shen Fu-Yun
• Ho Ming-Jaan
• Zhuang yi-qiang

Classifications

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K1/0216 Primary

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H05K2201/0394

  Conductor crossing over a hole in the substrate or a gap between two separate substrate parts · CPC title