Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus

Patent metadata

Field	Value
Publication number	US-12491600-B2
Application number	US-201916977935-A
Country	US
Kind code	B2
Filing date	Feb 26, 2019
Priority date	Mar 12, 2018
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

A substrate warpage correction method according to this disclosure corrects warpage of a substrate without performing a process on a front surface of the substrate. The substrate warpage correction method includes a surface roughening of performing a surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate.

First claim

What is claimed is:

1 . A substrate warpage correction method for correcting warpage of a plurality of substrates, the substrate warpage correction method comprising:
for each substrate of the plurality of substrates, before a surface roughening process, measuring a warpage amount in a warpage protruding to a front surface side of a substrate, and deciding a polishing pressure in advance based on a positive correlation between the polishing pressure and the warpage amount which is measured, for each substrate of the plurality of substrates, performing the surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate, and after the performing of the surface roughening process on the rear surface, stopping the performing of the surface roughening process and performing a transfer-out from the surface roughening processing apparatus of the substrate with the grooves only on the rear surface, wherein the performing of the surface roughening process on the rear surface forms grooves in the rear surface of the substrate at the polishing pressure throughout the surface roughening process for the substrate, the polishing pressure positively correlated in advance to the warpage amount in the warpage protruding to the front surface side of the substrate measured before the surface roughening process.

2 . The substrate warpage correction method according to claim 1 , wherein
the surface roughening processing apparatus comprises: a first holder configured to horizontally hold a region of the substrate not overlapping with a middle portion of the rear surface of the substrate; a second holder configured to horizontally hold the middle portion of the rear surface of the substrate, and spin the substrate around a first vertical axis; a sliding member configured to rotate around a second vertical axis different from the first vertical axis in order to slide on the rear surface of the substrate and perform the surface roughening process; a revolution mechanism configured to make the sliding member in rotation revolve around a vertical revolution axis different from the first vertical axis and the second vertical axis; and a relative moving mechanism configured to horizontally move relative positions of the substrate and the vertical revolution axis.

3 . The substrate warpage correction method according to claim 2 , wherein
the surface roughening process is performed at a revolution speed of the sliding member by the revolution mechanism according to the warpage amount of the substrate.

4 . The substrate warpage correction method according to claim 1 , wherein:
the surface roughening processing apparatus comprises a sliding member configured to rotate around a vertical axis in order to slide on the rear surface of the substrate to thereby perform a process; and the surface roughening process is performed using the sliding member, the sliding member comprising a contact surface with the rear surface of the substrate, the contact surface having a surface roughness according to the warpage amount of the substrate.

5 . The substrate warpage correction method according to claim 4 , wherein
the surface roughening process is performed using a plurality of the sliding members different from one another in the surface roughness, successively in order from the sliding member lower in the surface roughness.

6 . The substrate warpage correction method according to claim 1 , wherein
the surface roughening process is performed on a process region based on information about a distribution of the warpage of the substrate within the substrate.

7 . The substrate warpage correction method according to claim 6 , wherein
the process region includes a region in a shape protruding to the front surface side of the substrate.

8 . The substrate warpage correction method according to claim 6 , wherein
the process region includes a region adjacent to a region in a shape protruding to the front surface side of the substrate.

9 . A computer-readable storage medium storing a program running on a computer of a controller configured to control a surface roughening processing apparatus to cause the surface roughening processing apparatus to perform a warpage correction method for correcting warpage of a plurality of substrates,
the warpage correction method comprising
for each substrate of the plurality of substrates, before a surface roughening process, measuring a warpage amount in a warpage protruding to a front surface side of a substrate, and deciding a polishing pressure in advance based on a positive correlation between the polishing pressure and the warpage amount which is measured,
for each substrate of the plurality of substrates, performing the surface roughening process on a rear surface of the substrate using a surface roughening processing apparatus configured to be able to perform the surface roughening process on the rear surface of the substrate, to form grooves in the rear surface to thereby correct the warpage of the substrate, and
after the performing of the surface roughening process on the rear surface, stopping the performing of the surface roughening process and performing a transfer-out from the surface roughening processing apparatus of the substrate with the grooves only on the rear surface, wherein
the performing of the surface roughening process on the rear surface forms grooves in the rear surface of the substrate at the polishing pressure throughout the surface roughening process for the substrate, the polishing pressure positively correlated in advance to the warpage amount in the warpage protruding to the front surface side of the substrate measured before the surface roughening process.

10 . The computer-readable storage medium according to claim 9 , wherein
the surface roughening processing apparatus comprises: a first holder configured to horizontally hold a region of the substrate not overlapping with a middle portion of the rear surface of the substrate; a second holder configured to horizontally hold the middle portion of the rear surface of the substrate, and spin the substrate around a first vertical axis; a sliding member configured to rotate around a second vertical axis different from the first vertical axis in order to slide on the rear surface of the substrate and perform the surface roughening process; a revolution mechanism configured to make the sliding member in rotation revolve around a vertical revolution axis different from the first vertical axis and the second vertical axis; and a relative moving mechanism configured to horizontally move relative positions of the substrate and the vertical revolution axis.

11 . The computer-readable storage medium according to claim 10 , wherein
the surface roughening process is performed at a revolution speed of the sliding member by the revolution mechanism according to the warpage amount of the substrate.

12 . The computer-readable storage medium according to claim 9 , wherein:
the surface roughening processing apparatus comprises a sliding member configured to rotate around a vertical axis in order to slide on the rear surface of the substrate to thereby perform a process; and in the warpage correction method, the surface roughening process is performed using the sliding member, the sliding member comprising a contact surface with the rear surface of the substrate, the contact surface having a surface roughness according to the warpage amount o

Assignees

• Tokyo Electron Ltd

Inventors

• Kanetake Nozomu
• Kubo Akihiro
• Kodama Teruhiko
• Yamamoto Taro
• Takiguchi Yasushi
• Okamoto Yoshiki
• Hosaka Hayato

Classifications

• H10P72/0474

  comprising at least one lithography chamber · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title