Multi-LED structures with single current and voltage supplies

Patent metadata

Field	Value
Publication number	US-12490565-B2
Application number	US-202217991337-A
Country	US
Kind code	B2
Filing date	Nov 21, 2022
Priority date	May 28, 2020
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A multi-LED structure comprises a first LED and a separate second LED disposed on a common multi-LED native substrate. The LEDs each comprise a common first layer having a cantilever portion and a base portion and a common second layer having a light-emitting emission portion disposed only over the base portion. An LED electrode electrically connects the first LED to the second LED. The cantilever portion extends in a direction different from the base portion or a length of the cantilever portion is less than a distance between the emission portions of the first and second LEDs.

First claim

The invention claimed is:

1 . A multi-LED component structure, comprising:
a component substrate; a first multi-LED native substrate comprising a first semiconductor portion disposed on the component substrate, the first multi-LED native substrate having a first LED and a separate second LED formed in the first semiconductor portion, wherein the first LED and the second LED are native to the first multi-LED native substrate, both emit a first color of light, and are electrically connected to a first LED electrode; and a second multi-LED native substrate comprising a second semiconductor portion disposed over the component substrate, the second multi-LED native substrate having a third LED and a separate fourth LED formed in the second semiconductor portion, wherein the third LED and the fourth LED are native to the second multi-LED native substrate, both emit a second color of light, and are electrically connected to a second LED electrode electrically separate from the first LED electrode, wherein the first LED, the second LED, the third LED, and the fourth LED are electrically connected to a common electrical connection electrically separate from the first LED electrode and the second LED electrode.

2 . The multi-LED component structure of claim 1 , wherein at least one of (i) the first LED and the second LED are electrically connected in series and the third LED and the fourth LED are electrically connected in parallel and (ii) the second color of light is different from the first color of light.

3 . The multi-LED component structure of claim 1 , wherein the second multi-LED native substrate is disposed on the first multi-LED native substrate.

4 . The multi-LED component structure of claim 1 , further comprising a fifth LED non-native to the component substrate, the first multi-LED native substrate and the second multi-LED native substrate, wherein the fifth LED emits a different color of light from the first LED, the second LED, the third LED, and the fourth LED.

5 . An LED wafer, comprising a wafer comprising sacrificial portions separated by anchors, wherein the multi-LED component structure according to claim 1 is disposed entirely and completely over each sacrificial portion and each multi-LED component structure is physically connected to an anchor of the anchors with a tether.

6 . The multi-LED component structure of claim 1 , comprising an LED electrode disposed on at least a portion of the first LED and on at least a portion of the second LED, wherein the LED electrode is disposed on at least a portion of the first multi-LED native substrate.

7 . The multi-LED component structure of claim 1 , wherein the first LED and the second LED are electrically connected in serial.

8 . The multi-LED component structure of claim 1 , wherein the first LED and the second LED are electrically connected in parallel.

9 . The multi-LED component structure of claim 1 , wherein the first LED and the second LED have any one or combination of (i) substantially the same size, (ii) substantially the same area over the multi-LED substrate, and (iii) substantially the same light-emitting area.

10 . The multi-LED component structure of claim 1 , comprising an LED structure tether.

11 . The multi-LED component structure of claim 1 ,
wherein the first LED and the second LED each comprise a first layer having a cantilever portion and a base portion, the cantilever portion of the first LED extends in a first direction and the base portion of the first LED extends in a second direction different from the first direction, and wherein any one or combination of (i) the first multi-LED native substrate or the second multi-LED substrate has a surface and the first direction is orthogonal to the second direction and both the first and the second directions are substantially parallel to the surface, (ii) at least a portion of the first LED and at least a portion of the second LED extend in substantially a same direction, and (iii) at least a portion of the first LED and at least a portion of the second LED extend in substantially orthogonal directions.

12 . The multi-LED component structure of claim 1 , comprising an LED electrode disposed on at least a portion of the first LED and on at least a portion of the second LED, the LED electrode electrically connecting the first LED to the second LED.

13 . The multi-LED component structure of claim 12 , comprising a first LED contact disposed on the first LED and a second LED contact disposed on the second LED, wherein the first LED contact and the second LED contact are spatially separated from the LED electrode.

14 . The multi-LED component structure of claim 13 , wherein an LED contact separation distance between the first LED contact and the second LED contact is greater than (i) a first LED length of the first LED, (ii) a second LED length of the second LED, or (iii) the larger of the first LED length and the second LED length.

15 . The multi-LED component structure of claim 1 , wherein the first LED and the second LED each comprise a different semiconductor material from the third LED and the fourth LED.

16 . The multi-LED component structure of claim 1 , comprising one or more LEDs separate from the first LED and separate from the second LED disposed on the first multi-LED native substrate, wherein the first and second LEDs comprise a different semiconductor material from the one or more LEDs and the one or more LEDs are non-native to the first multi-LED substrate.

17 . The multi-LED component structure of claim 1 , wherein the first multi-LED native substrate comprises at least a portion of a first layer or a first layer comprises at least a portion of the first multi-LED native substrate and the first multi-LED native substrate is electrically conductive.

18 . A multi-LED component structure, comprising:
a component substrate; a first multi-LED native substrate disposed on the component substrate, the first multi-LED native substrate having a first LED and a separate second LED disposed thereon, wherein the first LED and the second LED are native to the first multi-LED native substrate and electrically connected; a second multi-LED native substrate having a third LED and a separate fourth LED disposed thereon, the third LED and the fourth LED are native to the second multi-LED native substrate and electrically connected; and one or more LEDs separate from the first LED and separate from the second LED disposed on the first multi-LED native substrate, wherein the first LED, the second LED, the third LED, and the fourth LED are electrically connected to a common electrical connection, and wherein the first and second LEDs comprise a different semiconductor material from the one or more LEDs and the one or more LEDs are non-native to the first multi-LED substrate.

Assignees

• X Display Company Tech Ltd

Inventors

• Cok Ronald S
• Meitl Matthew Alexander

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/032

  of electrodes · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/83

  Electrodes · CPC title