Post CMP cleaning composition

Patent metadata

Field	Value
Publication number	US-12486473-B2
Application number	US-202318124355-A
Country	US
Kind code	B2
Filing date	Mar 21, 2023
Priority date	Mar 23, 2022
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

The invention provides compositions useful in post-CMP cleaning operations where ceria is present. In one aspect, the invention provides a composition comprising a reducing agent; a chelating agent; an amino(C6-C12 alkyl)alcohol; and water; wherein the composition has a pH of less than about 8. The compositions of the invention were found to show improved ceria removal on, for example, poly silicon (poly Si) substrates. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in one or more containers, selected components of the compositions.

First claim

What is claimed is:

1 . A method for removing residues on a microelectronic device substrate, the method comprising:
contacting the surface of a microelectronic device substrate with a composition comprising:
a. a reducing agent;
b. a chelating agent;
c. an amino (C 6 -C 12 alkyl)alcohol; and
d. water;
wherein the composition has a pH of less than about 8, and wherein the composition further comprises 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid, or a salt thereof, and at least partially removing the residues from the substrate.

2 . The method of claim 1 , wherein the reducing agent is selected from the group consisting of hypophosphorous acid, diethylhydroxylamine, sulfurous acid, and L-ascorbic acid.

3 . The method of claim 1 , wherein the chelating agent is selected from the group consisting of aspartic acid, glutamic acid, citric acid, phosphoric acid, nitrile-tris (methylene phosphonic acid), and 1-hydroxyethylidene-1,1-diphosphonic acid.

4 . The method of claim 1 , wherein the composition further comprises a fluoride source.

5 . The method of claim 1 , wherein the composition further comprises a nonionic surfactant.

6 . The method of claim 1 , wherein the composition further comprises a water-miscible solvent.

7 . The method of claim 1 , wherein the composition further comprises a water-soluble or water-dispersible polymer.

8 . The method of claim 1 , wherein the composition further comprises at least one of poly(styrenesulfonic acid); polyoxyethylene(23) lauryl ether; glutamic acid, and aspartic acid.

9 . The method of claim 1 , wherein the composition is devoid of corrosion inhibitors.

Assignees

• Entegris Inc

Inventors

• Wang Volley
• Das Atanu K
• White Michael L
• Lee Chun-I
• Gunda Nilesh
• White Daniela
• Frye Donald

Classifications

• H10P70/237

  the processing being a planarisation of insulating layers · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• C11D3/042

  Acids · CPC title

• C11D3/361

  Phosphonates, phosphinates or phosphonites · CPC title

• C11D3/2075

  Carboxylic acids-salts thereof · CPC title