Systems and methods for active and passive cooling of electrical components

Patent metadata

Field	Value
Publication number	US-12484202-B2
Application number	US-202318162451-A
Country	US
Kind code	B2
Filing date	Jan 31, 2023
Priority date	Sep 28, 2022
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.

First claim

What is claimed is:

1 . A power module, comprising:
a heat generating electrical component; a passive heat dissipation element in contact with and facing a first surface of the heat generating electrical component, the passive heat dissipation element comprising:
one or more contact points, the one or more contact points including a curved surface; and
a planar surface facing the heat generating electrical component; and
a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from a second surface of the heat generating electrical component opposite the first surface, wherein each exterior surface of each of the plurality of fins includes a first exterior surface and a plurality of other exterior surfaces, the first exterior surface being attached to the base plate and the plurality of other exterior surfaces being floating surfaces, wherein the curved surface thermally connects the planar surface of the passive heat dissipation element to the fin system; and a fin housing including walls, the walls including a first end connected to the base plate and a second end defining an opening in a surface of the fin housing, wherein the walls define a chamber between the first end at the base plate and the second end at the opening, and wherein the plurality of fins extend less than a length of the chamber from the first end at the base plate to the second end at the opening.

2 . The power module of claim 1 , wherein the base plate is connected to the second surface of the heat generating electrical component via sintering to sealingly isolate the heat generating electrical component from the plurality of fins.

3 . The power module of claim 1 , wherein the fin housing comprises a casting and a fin housing base.

4 . The power module of claim 3 , wherein the fin housing comprises at least one of one or more protrusions that friction stir weld the second surface of the heat generating electrical component to the casting or one or more protrusions that epoxy attach the second surface of the heat generating electrical component to the casting.

5 . The power module of claim 3 , wherein the casting is at least one of sealing friction stir welded to the second surface of the heat generating electrical component or is sealing epoxy attached to the second surface of the heat generating electrical component.

6 . The power module of claim 3 , wherein an elastomeric seal connects the casting to the fin housing base.

7 . The power module of claim 1 , wherein the heat generating electrical component is configured to dissipate heat to the fin system via thermal contact between the heat generating electrical component and the fin system, the thermal contact being established via sintering.

8 . The power module of claim 1 , wherein the plurality of fins is from approximately 20 fins to approximately 200 fins.

9 . The power module of claim 1 , wherein fluid flowing through the chamber is sealingly isolated from the heat generating electrical component.

10 . The power module of claim 1 , further comprising Thermal Interface Material (TIM) between the fin system and the one or more contact points.

11 . The power module of claim 1 , wherein the base plate is sintered to the heat generating electrical component.

12 . The power module of claim 1 , wherein the plurality of fins extend less than 20% of a length of the walls of the fin housing.

Assignees

• Borgwarner Us Tech Llc

Inventors

• Gertiser Kevin M
• Fruth Chris

Classifications

• H05K2201/10166

  Transistor · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20854

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title