Inlay with exposed porous layer, component carrier and manufacturing methods

Patent metadata

Field	Value
Publication number	US-12484154-B2
Application number	US-202318188401-A
Country	US
Kind code	B2
Filing date	Mar 22, 2023
Priority date	Mar 23, 2022
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

First claim

The invention claimed is:

1 . An inlay for a component carrier, the inlay comprising:
a gas-permeable porous layer structure; an upper layer structure, arranged on the gas-permeable porous layer structure, wherein the upper layer structure comprises a cavity, configured so that an upper part of the gas-permeable porous layer structure is exposed; and an upper metal layer structure, arranged on the upper layer structure; wherein the upper metal layer comprises a metal layer cavity configured such that a part of the gas permeable porous layer structure is exposed.

2 . The inlay according to claim 1 , further comprising:
a lower layer structure arranged below the gas-permeable porous layer structure, wherein the lower layer structure comprises a further cavity, configured Se such that a lower part of the gas-permeable porous layer structure is exposed.

3 . The inlay according to claim 1 ,
wherein the upper layer structure and/or the lower layer structure comprises a photo-imageable material and/or a nanoimprint photolithography resist.

4 . The inlay according to claim 3 ,
wherein the photo-imageable material comprises a photo-imageable dielectric material; and/or wherein the photo-imageable dielectric material comprises advanced adhesion properties; and/or wherein the photo-imageable dielectric material comprises a polymer; and/or wherein the photo-imageable dielectric material comprises additives; and/or wherein the photo-imageable dielectric material is configured as a highly temperature stable material; and/or wherein the photo-imageable dielectric material is sensitive to UV radiation; and/or wherein the photo-imageable dielectric material comprises a negative or positive charged material; and/or wherein the photo-imageable dielectric material comprises a peel strength of 200 gf/cm or more; and/or wherein the photo-imageable curing temperature is in the range 100° C. to 300° C.

5 . The inlay according to claim 1 , further comprising:
an at least partial coating arranged on at least one main surface of the gas-permeable porous layer structure.

6 . The inlay according to claim 2 ,
wherein the lower layer structure comprises a different size and/or shape compared to the upper layer structure; and/or wherein the lower layer structure comprises a horizontal offset with respect to the upper layer structure; and/or wherein the cavity or the further cavity comprises a cylindrical or parallelepiped shape; and/or wherein the cavity comprises a patterned sub-structure of the upper layer structure.

7 . The inlay according to claim 2 , further comprising:
a lower metal layer structure, arranged below the lower layer structure.

8 . The inlay according to claim 1 ,
wherein the metal layer cavity comprises a tapering sidewall; and/or wherein the metal layer cavity has a larger diameter than the cavity.

9 . The inlay according to claim 2 ,
wherein the lower layer structure and/or the upper layer structure comprises conductive connection structures,
wherein an electronic component is connected to at least one of the conductive connection structures.

10 . The inlay according to claim 2 ,
wherein the upper metal layer structure and/or the lower layer structure is a continuous layer above the cavity and/or the further cavity; and/or wherein the cavity and/or the further cavity comprises sidewalls that are essentially not tapering.

11 . The inlay according to claim 1 ,
wherein the gas-permeable porous layer structure is configured as a membrane; and/or wherein the gas-permeable porous layer structure comprises a non-woven material; and/or wherein the gas-permeable porous layer structure is configured translucent or opaque; and/or wherein the gas-permeable porous layer structure is water-impermeable; and/or wherein the gas-permeable porous layer structure comprises a core and a coating, wherein the material of the core is different to the material of the coating; and/or wherein the gas-permeable porous layer structure comprises a treated surface, wherein the gas-permeable porous layer structure comprises at least one of the following functionalities: anti-bacterial, hydrophobic, anti-odor, pro-odor.

12 . The inlay according to claim 1 ,
wherein the gas-permeable porous layer structure comprises at least one material of the group consisting of an electrically conductive material and an electrically insulating material, a high-performance plastic material, wherein the high-performance plastic material comprises at least one of the group consisting of polyethylene terephthalate, polyoxymethylene, polyamide, polyimide, polytrimethylene terephthalate, polyetheretherketone, polyetherketonetherketoneketone, polyetherketone, ethylene tetrafluoroethylene, perfluoroalkoxy alkanes, fluorinated ethylene propylene, polytetrafluoroethylene, polyvinylidene fluoride, polyvinylidene difluoride, styrol polymerisate, polycarbonate, polyphenylene sulfide, polyethersulfone, polyphenylsulfone, polyisopren and polysulfone.

13 . A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; and an inlay including:
a gas-permeable porous layer structure;
an upper layer structure, arranged on the gas-permeable porous layer structure,
wherein the upper layer structure comprises a cavity, configured se such that an upper part of the gas-permeable porous layer structure is exposed;
an upper metal layer structure, arranged on the upper layer structure;
an upper stack cavity configured such that an upper part of the gas permeable porous layer structure is exposed;
wherein the inlay is assembled to the stack.

14 . The component carrier according to claim 13 , further comprising:
a lower stack cavity configured such that a lower part of the gas-permeable porous layer structure is exposed; and/or wherein the upper stack cavity or lower stack cavity is formed as a component carrier hole being a blind hole or through hole,
a through hole having at least one step-shaped sidewall; and/or
wherein the upper layer structure and/or the lower layer structure is connected to the electrically conductive layer structure by one or more pads; and/or
further comprising:
an electronic component, and
the component carrier hole, being a through hole or a blind hole, wherein the electronic component is arranged at least partially within the through hole or the blind hole,

mounted on the bottom of the blind hole,
wherein the through hole or the blind hole is circumferentially closed by the inlay; and/or
wherein the stack comprises a core layer structure, and
wherein the inlay is embedded at least partially in the core layer structure; and/or
further comprising:
an adhesive material at least partially arranged between the inlay and the stack.

15 . A method of manufacturing an inlay for a component carrier, the method comprising:
providing a gas-permeable porous layer structure; arranging a layer structure on the gas-permeable porous layer structure; forming a cavity in the layer structure, thereby exposing an upper part of the gas-permeable porous layer structure; arranging a metal layer structure on the layer structure; and forming a metal layer cavity in the metal layer such that a portion of the gas permeable porous layer structure is exposed.

16 . The method according to claim 15 ,
wherein the layer structure is provided by at least one of the group consisting of ink jetting, 3D-printing, paste-printing,

Assignees

• At&S Austria Tech & Systemtechnik Ag
• At & S Austria Tech & Systemtechnik Ag

Inventors

• Paller Stefanie
• Grober Gernot

Classifications

• H05K2201/10962

  Component not directly connected to the PCB · CPC title

• H05K2201/09827

  Tapered, e.g. tapered hole, via or groove · CPC title

• H05K2201/0949

  Pad close to a hole, not surrounding the hole · CPC title

• H05K2201/09072

  Hole or recess under component or special relationship between hole and component · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title