Improved semiconductor chip package thermo-mechanical cooling assembly
US-2026047437-A1 · Feb 12, 2026 · US
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Erike Eric patents
Erike Eric is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Erike Eric |
| Total patents | 8 |
| First publication | Jun 30, 2022 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods and apparatus to increase stacking pressure in battery cells
US-12482891-B2 · Nov 25, 2025 · US
Semiconductor chip package thermo-mechanical cooling assembly
US-12476167-B2 · Nov 18, 2025 · US
Interlinked ground wells with specialized patterns for liquid metal interposer
US-2025014980-A1 · Jan 9, 2025 · US
Patch interposer mold design for liquid metal carrier array
US-2024404896-A1 · Dec 5, 2024 · US
Liquid metal connection device and method
US-2024297119-A1 · Sep 5, 2024 · US
Methods and apparatus to increase stacking pressure in battery cells
US-2022216561-A1 · Jul 7, 2022 · US
Semiconductor chip package thermo-mechanical cooling assembly
US-2022208645-A1 · Jun 30, 2022 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/611 | 4 |
| H10W70/66 | 3 |
| H10W40/60 | 3 |
| H10W40/625 | 3 |
| H01L2023/4087 | 3 |