Display device with fusion region overlapping metal wiring

Patent metadata

Field	Value
Publication number	US-12466767-B2
Application number	US-202318378596-A
Country	US
Kind code	B2
Filing date	Oct 10, 2023
Priority date	Jan 14, 2020
Publication date	Nov 11, 2025
Grant date	Nov 11, 2025

Abstract

A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

First claim

What is claimed is:

1 . A method of fabricating a display device, the method comprising:
preparing a first substrate including a display area and a non-display area and a second substrate facing the first substrate; bonding the first substrate to the second substrate via a sealing member; and irradiating an intense light to the sealing member to form a fusion region having no physical boundary at the interface between the second substrate and the sealing member, the sealing member including:
a first extension portion extending in a first direction along the non-display area;
a second extension portion extending in a second direction intersecting the first direction; and
a first corner portion connected to the first extension portion and the second extension portion, the first corner portion having a curvature; and
the fusion region provided between the second substrate and the sealing member, wherein the fusion region is provided at least in the first corner portion of the sealing member, wherein the fusion region is also disposed in the first extension portion and the second extension portion of the sealing member, and wherein a plurality of fusion regions is spaced apart from each other in the first direction and the second direction.

2 . The method of claim 1 , wherein a focal point of the intense light is set to be separated from an upper surface of the second substrate, and a separation distance between the focal point of the intense light and the upper surface of the second substrate ranges from about 0.1 micrometers to about 200 micrometers.

3 . The method of claim 2 , wherein the intense light is irradiated at a frequency of about 1 kilohertz to 10 megahertz for about 10 femtoseconds to about 50 picoseconds.

4 . The method of claim 2 , wherein the fusion region is disposed over the sealing member and the second substrate and separated from the first substrate.

5 . The method of claim 4 , wherein the bonding the first substrate to the second substrate comprises filling frit crystals between the first substrate and the second substrate, and sintering and melting the frit crystals to form the sealing member.

6 . A method of fabricating a display device, the method comprising:
preparing a first substrate including a display area and a non-display area and a second substrate facing the first substrate; bonding the first substrate to the second substrate via a sealing member; and irradiating an intense light to the sealing member to form a fusion region having no physical boundary at the interface between the second substrate and the sealing member, wherein the fusion region includes a first portion positioned in parallel with the sealing member and a second portion positioned in parallel with the second substrate in a cross-sectional view, and wherein a maximum value of a width of the first portion is greater than a maximum value of a width of the second portion in the cross-sectional view, wherein the first portion and the second portion overlap each other in a direction perpendicular to a surface of the second substrate facing a surface of the first substrate.

7 . The method of claim 6 , wherein a focal point of the intense light is set to be separated from an upper surface of the second substrate, and a separation distance between the focal point of the intense light and the upper surface of the second substrate ranges from about 0.1 micrometers to about 200 micrometers.

8 . The method of claim 7 , wherein the intense light is irradiated at a frequency of about 1 kilohertz to 10 megahertz for about 10 femtoseconds to about 50 picoseconds.

9 . The method of claim 7 , wherein the fusion region is disposed over the sealing member and the second substrate and separated from the first substrate.

10 . The method of claim 9 , wherein the bonding the first substrate to the second substrate comprises filling frit crystals between the first substrate and the second substrate, and sintering and melting the frit crystals to form the sealing member.

11 . The method of claim 6 , wherein the first fusion region is provided by mixing a material of the sealing member with a material of the second substrate.

12 . The method of claim 6 , wherein a height of the first fusion region is greater than a thickness of the sealing member.

13 . The method of claim 6 , wherein the first fusion region includes a third boundary surface between the first portion and the sealing member and a fourth boundary surface between the second portion and the second substrate.

14 . The method of claim 6 , wherein a thickness of the sealing member ranges from about 4.5 micrometers to about 6 micrometers, and
a height of the first portion ranges from about 2 micrometers to about 4 micrometers.

Assignees

• Samsung Display Co Ltd

Inventors

• Kwon Yong Hoon
• Lee Hyun Ji
• Kim Jung Hyun
• Kim Tae Oh
• Jung So Mi

Classifications

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K77/10

  Substrates, e.g. flexible substrates · CPC title

• H10K59/131

  Interconnections, e.g. wiring lines or terminals · CPC title