Triangular board assembly for solid state drive

Patent metadata

Field	Value
Publication number	US-12464647-B2
Application number	US-202017133836-A
Country	US
Kind code	B2
Filing date	Dec 24, 2020
Priority date	Dec 24, 2020
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.

First claim

What is claimed is:

1 . An electronic apparatus, comprising:
a main board comprising a first surface which extends between a first edge of the main board and a second edge of the main board, wherein the second edge is opposite the first edge, the first surface comprising a first portion which extends to the first edge, a second portion which extends to the second edge, and a third portion between the first portion and the second portion, wherein the first portion, the second portion, and the third portion are substantially equal in size; a first wing board electrically coupled to the main board by a first flexible connector along the first edge, wherein the first wing board is disposed over the third portion, wherein the first flexible connector extends horizontally across the first portion to each of the first wing board and the first edge, and wherein the first wing board is arranged at a first angle that is non-parallel with respect to the main board, a second wing board electrically coupled to the main board by a second flexible connector along the second edge, wherein the second wing board is disposed over the third portion, wherein the second flexible connector extends horizontally across the second portion to each of the second wing board and the second edge, and wherein the second wing board is arranged at a second angle that is non-parallel with respect to the main board; and a substantially triangular thermally conductive support structure disposed over the third portion, wherein:
the substantially triangular thermally conductive support structure is not in contact with the first portion and the second portion,
the substantially triangular thermally conductive support structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the main board, and
the substantially triangular thermally conductive support structure is in mechanical and thermal communication with respective first sides of each of the main board, the first wing board, and the second wing board.

2 . The apparatus of claim 1 , wherein the thermally conductive support structure provides an interior air flow channel.

3 . The apparatus of claim 2 , wherein the thermally conductive support structure comprises a substantially triangular metal extrusion with a substantially triangular interior air flow channel.

4 . The apparatus of claim 1 , further comprising:
a thermally conductive enclosure disposed around the main board, the first wing board, the second wing board, and the thermally conductive support structure, the thermally conductive enclosure in mechanical and thermal communication with respective second sides of each of the main board, the first wing board, and the second wing board.

5 . The apparatus of claim 4 , wherein the thermally conductive enclosure comprises:
a first wall with a same angle as the first angle and positioned in mechanical and thermal communication with the second side of the first wing board; and a second wall with a same angle as the second angle and positioned in mechanical and thermal communication with the second side of the second wing board.

6 . The apparatus of claim 5 , wherein the thermally conductive enclosure comprises:
a first set of fins disposed on an exterior side of the first wall; and a second set of fins disposed on an exterior side of the second wall.

Assignees

• Sk Hynix Nand Product Solutions Corp

Inventors

• Hung John
• Morning-Smith Andrew
• Schmidt Kai-Uwe
• Gwin Paul
• Yao Nan Allison

Classifications

• H05K2201/046

  Planar parts of folded PCBs making an angle relative to each other · CPC title

• H05K2201/10159

  Memory · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title