PCBA cartridge sub-assembly

Patent metadata

Field	Value
Publication number	US-9955596-B2
Application number	US-201615233410-A
Country	US
Kind code	B2
Filing date	Aug 10, 2016
Priority date	Aug 10, 2016
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A memory cartridge for use during assembly of a storage drive apparatus. The memory cartridge includes a first memory printed circuit board (PCB). The memory cartridge also includes a second memory PCB, where the second memory PCB is operatively coupled to the first memory PCB by a first flexible connection. The memory cartridge also includes a chassis configured to fasten to the first memory PCB and to the second memory PCB such that the first and second memory PCBs have a spaced relationship to each other, and where the spaced relationship defines a gap.

First claim

What is claimed is:

1. A method of making a memory cartridge, comprising:
operatively coupling a first memory printed circuit board (PCB) to a second memory PCB, using a first flexible connection, wherein the first flexible connection connects using a male-female type socket for operative connection, and wherein the first flexible connection is configured to allow the second memory PCB to fold with respect to the first memory PCB;
positioning a first space-defining element relative to the first memory PCB and the second memory PCB, wherein once positioned, the first space-defining element is spaced from the first flexible connection;
folding the second memory PCB with respect to the first memory PCB using the first flexible connection while the first memory PCB remains operatively coupled to the second memory PCB; and
securing, using the first space-defining element, the first and second PCBs in a substantially fixed spaced relationship, wherein the spaced relationship defines a first gap between the first space-defining element and the first and second PCBs.

2. The method of claim 1 , further comprising fastening at least one of the first and second memory PCBs to the first space-defining element, wherein the first space-defining element is a rigid chassis.

3. The method of claim 1 , further comprising:
placing the memory cartridge inside a storage device housing configured to receive the memory cartridge by having at least one end that is open; and
sealing the memory cartridge inside the storage device housing with a cover configured to interface with the storage device housing.

4. The method of claim 1 , further comprising:
operatively coupling a third memory PCB to the first memory PCB using a second flexible connection, wherein the second flexible connection is configured to allow the third memory PCB to fold with respect to the first memory PCB; and
folding the third memory PCB with respect to the first memory PCB using the second flexible connection while the first memory PCB remains operatively coupled to the third memory PCB;
wherein the third memory PCB is coplanar with the second memory PCB;
wherein the second and third memory PCBs together form an outline not greater than an outline formed by the first memory PCB.

5. The method of claim 4 , further comprising:
positioning a second space-defining element relative to the first memory PCB and a third memory PCB; and
securing, using the second space-defining element, the first and third PCBs in a substantially fixed spaced relationship, wherein the spaced relationship defines a second gap between the second space-defining element and the first and third PCBs.

6. The method of claim 5 , further comprising filling the first gap and the second gap with a thermal interface material, and wherein the thermal interface material is thermally interfaced with the first, second, and third memory PCBs.

7. The method of claim 4 , wherein the second and third memory PCBs together form an outline substantially equal to an outline formed by the first memory PCB.

8. The method of claim 5 , wherein the first space-defining element and the second space-defining element are the same space-defining element.

9. The method of claim 1 , wherein the male-female type socket uses a friction-based connection.

10. The method of claim 1 , wherein the male-female type socket of the first or second memory PCB uses a plastic snap-type fastener that is configured to slide into an opening and spring open once through the other memory PCB.

11. A memory cartridge for use during assembly of a storage drive apparatus, comprising:
a first memory printed circuit board (PCB);
a second memory PCB, wherein the second memory PCB is operatively coupled to the first memory PCB by a first flexible connection, wherein the first flexible connection is configured to allow the second memory PCB to fold with respect to the first memory PCB while operatively coupled; and
a chassis configured to fasten to the first memory PCB and to the second memory PCB such that the first and second memory PCBs have a spaced relationship to each other, wherein the spaced relationship defines a first gap between the chassis and the first and second PCBs, and wherein the chassis is spaced from the first flexible connection.

12. The memory cartridge of claim 11 , wherein the chassis is a rigid chassis configured to cause the spaced relationship of the first and second memory PCBs to be fixed in substantially parallel planes to each other.

13. The memory cartridge of claim 11 , further comprising:
a third memory PCB, wherein the third memory PCB is operatively coupled to the first memory PCB by a second flexible connection, wherein the second flexible connection is configured to allow the third memory PCB to fold with respect to the first memory PCB while operatively coupled; and
wherein the chassis is further configured to fasten the third memory PCB such that the first and third memory PCBs have a spaced relationship to each other, wherein the spaced relationship defines a second gap between the chassis and the first and third PCBs, and wherein the chassis is spaced from the second flexible connection.

14. The memory cartridge of claim 13 , further comprising:
a thermal interface material filling the second gap, and wherein the thermal interface material is thermally interfaced with the first and third memory PCBs.

15. The memory cartridge of claim 11 , further comprising:
a thermal interface material filling the first gap, and wherein the thermal interface material is thermally interfaced with the first and second memory PCBs.

16. The memory cartridge of claim 11 , wherein the memory cartridge is configured to be placed in a storage device housing.

17. A chassis for use with a printed circuit board assembly, comprising:
a rigid frame having a first side and a second side; and
a plurality of pillar spacers extending from the rigid frame, the plurality of pillar spacers configured to interface with a plurality of printed circuit boards (PCBs);
wherein a first group of pillar spacers are located on the first side of the rigid frame and a second group of pillar spacers are located on the second side of the rigid frame;
wherein the first group of pillar spacers is configured to fasten to a first PCB of the plurality of PCBs;
wherein the second group of pillar spacers is configured to fasten to a second PCB of the plurality of PCBs;
wherein the rigid frame is configured to locate and fixedly space each PCB of the plurality of PCBs in a spaced relationship, wherein the spaced relationship defines a gap between the rigid frame and the first and second PCB.

18. The chassis of claim 17 , wherein the gap is filled with thermal interface material, and wherein the thermal interface material is thermally interfaced with the first and second PCBs.

19. The chassis of claim 17 , wherein the rigid frame is further configured to fixedly space the plurality of PCBs in a parallel relationship.

20. The chassis of claim 17 , wherein each pillar spacer of the plurality of pillar spacers includes a threaded hole.

Assignees

• Seagate Technology Llc

Inventors

• Voss William Gunther
• Bloyer Donald R
• Lester Nathan Loren

Classifications

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K2201/10159

  Memory · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K5/0217

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title