Power module

Patent metadata

Field	Value
Publication number	US-9807914-B2
Application number	US-201514788808-A
Country	US
Kind code	B2
Filing date	Jul 1, 2015
Priority date	Nov 28, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

First claim

What is claimed is:

1. A power module, comprising:
a plurality of substrates, located on different planes and surrounding an axis, wherein each of the substrates extends along the axis;
a plurality of power devices, disposed on the substrates respectively and electrically connected with each other; and
a heat dissipation assembly, disposed on the substrates and opposite to the power devices, wherein heat generated from the power devices is transferred to the heat dissipation assembly through the substrates, and the heat dissipation assembly comprises:
a main channel, located on and extending along the axis, wherein the main channel has an inlet and an outlet;
a plurality of first branch channels, directly connected to the inlet or the outlet of the main channel; and
a plurality of second branch channels, respectively formed on one side of the substrates opposite to the power devices and connected between the inlet and the outlet of the main channel through the first branch channels, wherein each of the first branch channels has one end connected to the main channel and another end connected to an end of the one of the second branch channels.

2. The power module as recited in claim 1 , wherein the substrates surround the axis to form a closed contour, the power devices are located outside the closed contour, and the heat dissipation assembly is located inside the closed contour.

3. The power module as recited in claim 2 , wherein the closed contour is a polygon.

4. The power module as recited in claim 2 , wherein the substrates form a columnar structure having openings on both ends, and the closed contour is a cross-section contour of the columnar structure.

5. The power module as recited in claim 2 , wherein an electronic apparatus is adapted for being disposed on the closed contour.

6. The power module as recited in claim 1 , wherein the substrates are symmetrical with respect to the axis.

7. The power module as recited in claim 1 , wherein each of the substrates are divided into two ends along the axis, and the inlet and the outlet of the main channel are located on same end.

8. The power module as recited in claim 1 , wherein each of the substrates are divided into two ends along the axis, and the inlet and the outlet of the main channel are located on opposite ends.

9. The power module as recited in claim 1 , wherein each of the substrates are divided into two ends, and the heat dissipation assembly comprises a plurality of members, a portion of the members being disposed on the axis while the main channel being located in the members disposed on the axis, and other portion of the members being disposed on corresponding substrate and opposite to the power devices while the second branch channels are disposed respectively on the other portion of the members.

10. The power module as recited in claim 1 , wherein the second branch channels running through the substrates render a curving path.

11. The power module as recited in claim 1 , wherein the second branch channels running through the substrates render a plurality of paths that are juxtaposed and end-to-end.

12. The power module as recited in claim 1 , wherein the substrates are electrically connected by a substrate interconnection structure.

13. The power module as recited in claim 12 , wherein the substrate interconnection structure is a metal wire.

14. The power module as recited in claim 12 , wherein the substrate interconnection structure is a flexible printed circuit board.

Assignees

• Ind Tech Res Inst

Inventors

• Liu Chun-Kai
• Chao Yu-Lin

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/14329

  specially adapted for the configuration of power bus bars · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title