Method for bonding chips to a substrate by direct bonding

Patent metadata

Field	Value
Publication number	US-12463174-B2
Application number	US-202017786000-A
Country	US
Kind code	B2
Filing date	Dec 17, 2020
Priority date	Dec 19, 2019
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, where the action of bringing the chips into contact with the liquid film causes attraction of the chips toward the substrate, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

First claim

The invention claimed is:

1 . A process for bonding chips to a substrate by direct bonding, the bonding process comprising
providing a support comprising an adhesive film with which the chips are in contact, the chips in contact with the adhesive film being separate from one another, forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, which action of bringing the chips into contact with the liquid film causes an attraction of the chips toward the substrate, after bringing the chips in contact with the liquid film, separating the support from the adhesive film, the adhesive film remaining connected to the chips, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

2 . The bonding process as claimed in claim 1 , wherein the liquid film is a film of deionized water.

3 . The bonding process as claimed in claim 1 , wherein forming the liquid film comprises depositing the liquid film on the face of the substrate by centrifuging.

4 . The bonding process as claimed in claim 1 , wherein bringing the chips into contact with the liquid film is carried out by bringing the substrate and the support together.

5 . The bonding process as claimed in claim 4 , comprising
using at least one abutment arranged between the substrate and the support to halt the bringing together which provides for the chips to be brought into contact with the liquid film, resulting in that, when the bringing together is halted, wherein the chips are in contact with the liquid film, and the liquid film separates each chip from the substrate.

6 . The bonding process as claimed in claim 5 , wherein
the process comprises bonding the abutment to the adhesive film and bringing the abutment into contact with the substrate after the bonding of the abutment to the adhesive film, and at a moment of the contact of the abutment with the substrate, the chips are in contact with the liquid film.

7 . The bonding process as claimed in claim 1 , wherein:
the adhesive film exhibits an elasticity such that the adhesive deforms during the evaporating, and after bonding of the chips to the substrate, the bonding process comprises removing the adhesive film.

8 . The bonding process as claimed in claim 7 , wherein removing the adhesive film comprises treating the adhesive film by heating the adhesive film or exposing the adhesive film to ultraviolet radiation.

9 . The bonding process as claimed in claim 1 , comprising keeping the substrate horizontal to plus or minus 1 degree during the evaporating.

10 . The bonding process as claimed in claim 1 , comprising, after separating the support from the adhesive film, removing the adhesive film from the chips.

11 . A process for bonding chips to a substrate by direct bonding, the bonding process comprising
providing a support with which the chips are in contact, the chips in contact with the support being separate from one another, forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film by bringing the substrate and the support together, which action of bringing the chips into contact with the liquid film causes an attraction of the chips toward the substrate, using at least one abutment arranged between the substrate and the support to halt the bringing together which provides for the chips to be brought into contact with the liquid film, resulting in that, when the bringing together is halted, wherein
the chips are in contact with the liquid film, and
the liquid film separates each chip from the substrate, and
evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

12 . The bonding process as claimed in claim 11 , wherein the support is a mechanical grip on which the chips rest.

13 . The bonding process as claimed in claim 12 , wherein the mechanical grip comprises cavities, each chip being positioned in one of the cavities and protruding from the one cavity, the process further comprising removing the chips from the cavities after the chips are brought into contact with the liquid film and before the chips are bonded to the substrate.

14 . The process as claimed in claim 13 , wherein removing the chips from the cavities is carried out by moving the support and the substrate apart.

15 . The bonding process as claimed in claim 11 , wherein:
the support is a mechanical grip on which the chips rest, the process comprises positioning the at least one abutment on the mechanical grip and bringing the substrate into contact with the abutment after having positioned the abutment on the mechanical grip, and at a moment of the contact of the substrate with the abutment, the chips are in contact with the liquid film.

Assignees

• Commissariat Energie Atomique

Inventors

• Fournel Frank
• Sanchez Loic
• Montmayeul Brigitte

Classifications

• H10W80/00

  Direct bonding of chips, wafers or substrates · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/011

  Apparatus therefor · CPC title

• H10W80/301

  Bonding techniques, e.g. hybrid bonding · CPC title