Method for bonding chips to a substrate by direct bonding
US-12463174-B2 · Nov 4, 2025 · US
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Sanchez Loic patents
Sanchez Loic is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sanchez Loic |
| Total patents | 9 |
| First publication | May 26, 2016 |
| Latest publication | Nov 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for transferring chips
US-11694991-B2 · Jul 4, 2023 · US
Method for bonding chips to a substrate by direct bonding
US-2023029338-A1 · Jan 26, 2023 · US
Method for transferring chips
US-2021407961-A1 · Dec 30, 2021 · US
Method for direct bonding with self-alignment using ultrasound
US-10438921-B2 · Oct 8, 2019 · US
Method for direct bonding with self-alignment using ultrasound
US-2018218997-A1 · Aug 2, 2018 · US
Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
US-9586207-B2 · Mar 7, 2017 · US
Device and method for individual support of components
US-9455174-B2 · Sep 27, 2016 · US
Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
US-2016144365-A1 · May 26, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Commissariat Energie Atomique | 9 |
| St Microelectronics Crolles 2 Sas | 1 |
| Commissariat L Energie Atomique Et Aux Energies Alternatives | 1 |
| Commissariat A L'Energie Atomique Et Aux Ene Alt | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 8 |
| H10P72/7402 | 4 |
| H10W72/07173 | 4 |
| H10W72/0711 | 4 |
| H10P72/7428 | 4 |