Nonvolatile memory device and operating method of the same

US12457754B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12457754-B2
Application numberUS-202318169436-A
CountryUS
Kind codeB2
Filing dateFeb 15, 2023
Priority dateAug 16, 2022
Publication dateOct 28, 2025
Grant dateOct 28, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Provided are a nonvolatile memory device and an operating method thereof. The nonvolatile memory device may include a conductive pillar, a resistance change layer surrounding a side surface of the conductive pillar, a semiconductor layer surrounding a side surface of the resistance change layer, a gate insulating layer surrounding a side surface of the semiconductor layer, and a plurality of insulating patterns and a plurality of gate electrodes alternately arranged along a surface of the gate insulating layer. The plurality of insulating patterns and the plurality of gate electrodes may surround a side surface of the gate insulating layer.

First claim

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What is claimed is: 1. A nonvolatile memory device comprising: a conductive pillar; a resistance change layer surrounding a side surface of the conductive pillar; a semiconductor layer surrounding a side surface of the resistance change layer; a gate insulating layer surrounding a side surface of the semiconductor layer; a plurality of insulating patterns and a plurality of gate electrodes, the plurality of insulating patterns and the plurality of gate electrodes being alternately arranged along a surface of the gate insulating layer, and the plurality of insulating patterns and the plurality of gate electrodes surrounding a side surface of the gate insulating layer; a second bit line electrically connected to the conductive pillar, the second bit line being configured to provide a first voltage to the conductive pillar; and a first bit line electrically insulated from the second bit line, the first bit line being electrically connected to the semiconductor layer, and the first bit line being configured to provide a second voltage to the semiconductor layer. 2. The nonvolatile memory device of claim 1 , wherein the first voltage and the second voltage are different from each other. 3. The nonvolatile memory device of claim 1 , wherein the first voltage is greater than the second voltage. 4. The nonvolatile memory device of claim 1 , wherein a difference between the first voltage and the second voltage is less than an absolute value of the second voltage. 5. The nonvolatile memory device of claim 1 , wherein an absolute value of the second voltage is about 5 V or less. 6. The nonvolatile memory device of claim 1 , further comprising: a controller, wherein the controller is configured to apply a turn-off voltage to a gate electrode corresponding to a selection memory cell in the plurality of gate electrodes, and the controller is configured to apply a turn-on voltage to a gate electrode corresponding to a non-selection memory cell in the plurality of gate electrodes. 7. The nonvolatile memory device of claim 6 , wherein the turn-off voltage is less than at least one of the first voltage and the second voltage. 8. The nonvolatile memory device of claim 6 , wherein the turn-on voltage is greater than at least one of the first voltage and the second voltage. 9. The nonvolatile memory device of claim 6 , wherein a difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage. 10. The nonvolatile memory device of claim 1 , wherein all regions of the conductive pillar are spatially spaced apart from all regions of the semiconductor layer. 11. The nonvolatile memory device of claim 1 , further comprising: an insulating layer between the resistance change layer and the conductive pillar. 12. The nonvolatile memory device of claim 1 , further comprising: an insulating layer in the conductive pillar. 13. The nonvolatile memory device of claim 12 , wherein the insulating layer in the conductive pillar is in contact with the resistance change layer. 14. An operating method of a nonvolatile memory device, the nonvolatile memory device including a conductive pillar and a memory cell array along a side of the conductive pillar, the operating method comprising: applying a turn-off voltage to a selection memory cell in the memory cell array; applying a turn-on voltage to a non-selection memory cell in the memory cell array; and during an operation on the selection memory cell, applying a first voltage to the conductive pillar and applying a second voltage to the memory cell array, the second voltage being different from the first voltage, wherein a difference between the first voltage and the second voltage is less than an absolute value of the second voltage. 15. The operating method of claim 14 , wherein the first voltage is greater than the second voltage. 16. The operating method of claim 14 , wherein the difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage. 17. The operating method of claim 14 , wherein the absolute value of the second voltage is about 5 V or less. 18. The operating method of claim 14 , wherein the turn-off voltage is less than at least one of the first voltage and the second voltage. 19. The operating method of claim 14 , wherein the turn-on voltage is greater than at least one of the first voltage and the second voltage. 20. An operating method of a nonvolatile memory device, the nonvolatile memory device including a conductive pillar and a memory cell array along a side of the conductive pillar, the operating method comprising: applying a turn-off voltage to a selection memory cell in the memory cell array; applying a turn-on voltage to a non-selection memory cell in the memory cell array; and during an operation on the selection memory cell, applying a first voltage to the conductive pillar and applying a second voltage to the memory cell array, the second voltage being different from the first voltage, wherein a difference between the first voltage and the second voltage is less than a difference between the turn-on voltage and the turn-off voltage.

Assignees

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Classifications

  • Array wherein the access device being a transistor · CPC title

  • Array having a NAND structure comprising, for example, memory cells in series or memory elements in series, a memory element being a memory cell in parallel with an access transistor · CPC title

  • Three dimensional array · CPC title

  • Cell access · CPC title

  • comprising metal oxide memory material, e.g. perovskites · CPC title

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What does patent US12457754B2 cover?
Provided are a nonvolatile memory device and an operating method thereof. The nonvolatile memory device may include a conductive pillar, a resistance change layer surrounding a side surface of the conductive pillar, a semiconductor layer surrounding a side surface of the resistance change layer, a gate insulating layer surrounding a side surface of the semiconductor layer, and a plurality of in…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10B63/34. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 28 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).