Cooling module comprising a cooling structure for dissipation of heat

Patent metadata

Field	Value
Publication number	US-12457716-B2
Application number	US-202217730983-A
Country	US
Kind code	B2
Filing date	Apr 27, 2022
Priority date	Apr 29, 2021
Publication date	Oct 28, 2025
Grant date	Oct 28, 2025

Abstract

The invention concerns an alveolar cooling structure ( 3 ) which is configured to dissipate the heat generated by at least one electronic component ( 40 ) placed on an upper surface ( 21 ) of a substrate ( 2 ), the alveolar cooling structure ( 3 ) being in contact with an inner surface ( 22 ) of the said substrate ( 2 ). The alveolar cooling structure ( 3 ) comprises cells, the cell edges of which increase a total contact surface between the alveolar cooling structure ( 3 ) and a cooling fluid; and pores which are defined by the cells and distributed in the volume of the alveolar cooling structure ( 3 ), the cooling fluid circulating through the pores and/or through the spaces between the pores.

First claim

The invention claimed is:

1 . Alveolar cooling structure which is configured to dissipate the heat generated by at least one electronic component placed on an upper surface of a substrate fitted over a chamber, the alveolar cooling structure being in contact with an inner surface of the said substrate, the alveolar cooling structure, comprising:
cells, wherein cell edges of which increase a total contact surface between the alveolar cooling structure and a cooling fluid; and pores which are defined by the cells and distributed in the volume of the alveolar cooling structure, the cooling fluid circulating through the pores and/or through the spaces between the pores, wherein the alveolar cooling structure comprises a porosity of between 75% and 95% of the volume of the alveolar cooling structure, and wherein the alveolar cooling structure comprises independent portions connected to contact points distributed in contact areas of a lower surface of the substrate, wherein the alveolar cooling structure is in the form of a pipe coil, wherein the pipe coil is disposed within the chamber and connected with the lower surface of the substrate and a base of the chamber.

2 . The alveolar cooling structure according to claim 1 , being produced by 3D printing.

3 . The alveolar cooling structure according to claim 1 , being in contact with a contact area of the inner surface, as well as being immersed in the cooling fluid.

4 . The alveolar cooling structure according to claim 3 , comprising independent portions which are connected respectively to contact areas and/or to contact points distributed in the contact area of the inner surface.

5 . The alveolar cooling structure according to claim 1 , being constituted by a material having thermal conductivity which is greater than that of the cooling fluid.

6 . The alveolar cooling structure according to claim 3 , being connected to the contact area of the inner surface by sintering, welding, gluing, or by compression.

7 . The alveolar cooling structure according to claim 1 , being formed together with the substrate by 3D printing.

8 . A cooling module for an electronic module for an electric or hybrid motor vehicle, the cooling module being configured to dissipate the heat generated by the electronic module, the cooling module comprising:
at least one alveolar cooling structure according to claim 1 , the at least one alveolar cooling structure being in contact with at least one substrate of the electronic module.

9 . The cooling module according to claim 8 , comprising at least one chamber which is configured to contain the cooling fluid, and the at least one alveolar cooling structure.

10 . The cooling module according to claim 8 , comprising the cooling fluid.

11 . An electronic module which is designed to be incorporated in an electrical assembly of an electric or hybrid motor vehicle, the electronic module, comprising:
at least one substrate comprising an upper surface and a lower surface; at least one electronic component placed on the upper surface of the at least one substrate; and a cooling module according to claim 8 , the cooling module being in contact with the lower surface of the at least one substrate and comprising at least one alveolar cooling structure which is in contact with the lower surface of the at least one substrate.

12 . The electronic module according to claim 11 , being an electronic power module, wherein the at least one electronic component is a semiconductor power chip.

13 . The electrical assembly for an electric or hybrid motor vehicle, comprising an electronic module according to claim 11 .

14 . The electrical assembly according to claim 13 , being an inverter or a direct-direct voltage converter.

15 . The alveolar cooling structure according to claim 1 ,
wherein each independent portion is formed in a curved strip having a thickness.

16 . The alveolar cooling structure according to claim 1 ,
wherein each contact point is situated in the vicinity of an area with higher temperature.

Assignees

• Valeo Siemens Eautomotive France Sas

Inventors

• Verhoog Roelof

Classifications

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• F28F7/02

  Blocks traversed by passages for heat-exchange media {(F28D7/0008 takes precedence)} · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title