EMI shielding structure having heat dissipation unit and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10068832-B2
Application number	US-201715840326-A
Country	US
Kind code	B2
Filing date	Dec 13, 2017
Priority date	Jan 13, 2017
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

First claim

What is claimed is:

1. An electromagnetic interference shielding structure, comprising:
an insulating member covering at least one circuit element mounted on a printed circuit board (PCB);
a shielding member covering the insulating member; and
a heat dissipator having a surface adhered to the shielding member and configured to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low,
wherein an upper surface of the shielding member is formed with an insertion groove into which a part of the heat dissipator is inserted.

2. The electromagnetic interference shielding structure as claimed in claim 1 , wherein at least a part of the heat dissipator is embedded in the shielding member.

3. The electromagnetic interference shielding structure as claimed in claim 1 , wherein the heat dissipator is inserted into a groove formed on a heat dissipation target disposed opposite to the upper surface of the shielding member.

4. The electromagnetic interference shielding structure as claimed in claim 1 ,
wherein an inner space of the heat dissipator is stored with a liquefied volatile material, and
wherein the inner space is formed with a passage through which a gaseous volatile material moves.

5. The electromagnetic interference shielding structure as claimed in claim 4 , wherein the passage is formed of any one of a porous member, a plurality of channels formed by a plurality of fine patterns, and a net member.

6. The electromagnetic interference shielding structure as claimed in claim 1 ,
wherein the shielding member includes a shielding dam surrounding a side surface of the insulating member, an edge bridge formed on an upper part of the shielding dam, and a shielding layer covering the upper surface of the insulating member and contacting the edge bridge, and
wherein the heat dissipator is embedded in the shielding layer.

7. The electromagnetic interference shielding structure as claimed in claim 1 , wherein the heat dissipator is provided in plural.

8. The electromagnetic interference shielding structure as claimed in claim 1 , wherein the heat dissipator is formed on a heat dissipation target corresponding to the upper surface of the shielding member.

9. The electromagnetic interference shielding structure as claimed in claim 8 , wherein the heat dissipator includes:
a first fine pattern formed on a recess of one surface of the heat dissipation target;
a metal sheet bonded to the heat dissipation target;
a second fine pattern formed on one surface of the metal sheet to face the first fine pattern; and
a liquefied volatile material stored in an inner space of the heat dissipator.

10. The electromagnetic interference shielding structure as claimed in claim 9 , wherein the first and second fine patterns are formed by three-dimensional (3D) printing.

11. The electromagnetic interference shielding structure as claimed in claim 9 , wherein a part of the first fine pattern or a part of the second fine pattern is formed to have a height larger than that of the first and second fine patterns.

12. The electromagnetic interference shielding structure as claimed in claim 9 ,
wherein the heat dissipation target is formed with a plurality of holes for injecting a volatile material into an inner space of the heat dissipation target, and
wherein the plurality of holes is closed by a sealing member.

13. An electromagnetic interference shielding structure, comprising:
an insulating member covering at least one circuit element mounted on a printed circuit board (PCB);
a shielding member covering the insulating member; and
a heat dissipator integrally formed on an upper part of the shielding member and configured to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low,
wherein an inner space of the heat dissipator is
stored with a liquefied volatile material, and
formed with a plurality of channels through which the volatile material moves along an inner side surface thereof.

14. A method for manufacturing an electromagnetic interference shielding structure, the method comprising:
forming a shielding dam to surround at least one circuit element mounted on a printed circuit board (PCB);
forming an insulating member covering the at least one circuit element in a space formed by the shielding dam;
disposing a heat dissipator on an upper surface of the insulating member;
after the disposing of the heat dissipator, forming an edge bridge along an upper end of the shielding dam; and
forming a shielding layer covering the insulating member and the heat dissipator in the space formed by the edge bridge.

15. The method as claimed in claim 14 , further comprising:
after the disposing of the heat dissipator, forming a shielding layer covering an upper end of the shielding dam and the heat dissipator.

16. A method for manufacturing an electromagnetic interference shielding structure, the method comprising:
forming a shielding dam to surround at least one circuit element mounted on a printed circuit board (PCB);
forming an insulating member covering the at least one circuit element in a space formed by the shielding dam;
forming a shielding layer covering an upper end of the shielding dam and the insulating member; and
disposing a heat dissipator on an upper surface of the shielding layer,
wherein in the forming of the shielding layer, a recess into which a part of the heat dissipator is inserted is formed.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Han Eun-Bong
• KIM Hyeon-hyang

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W42/273

  the arrangements being between laterally adjacent chips, e.g. walls between chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title