Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Patent metadata

Field	Value
Publication number	US-12448490-B2
Application number	US-202318323562-A
Country	US
Kind code	B2
Filing date	May 25, 2023
Priority date	Jan 11, 2018
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

First claim

The invention claimed is:

1. A molding film comprising: a cyclic aliphatic epoxy resin matrix; and an inorganic filler dispersed in the cyclic aliphatic epoxy resin matrix, wherein an absolute value of the difference between a refractive index of the cyclic aliphatic epoxy resin matrix and a refractive index of the inorganic filler is 0.1 or less,
wherein the cyclic aliphatic epoxy resin matrix includes a cyclic aliphatic epoxy resin containing a reaction product between an epoxy structure represented by the following Chemical Formula 1 and an epoxy compound represented by the following Chemical Formula 2:

wherein, in the Chemical Formula 1, R is an alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 3 to 20 carbon atoms, n is an integer from 1 to 30, C 1 is a cycloalkane having 3 to 10 carbon atoms, and L 1 is a direct bond or an alkylene group having 1 to 10 carbon atoms,

wherein, in the Chemical Formula 2, C 2 to C 3 are each independently a cycloalkane having 3 to 10 carbon atoms to which an epoxy group is bonded, and L 2 is a direct bond or an alkylene group having 1 to 10 carbon atoms, and
wherein the epoxy compound is in an amount of 50 parts by weight or more and 90 parts by weight or less, based on 100 parts by weight of the epoxy structure represented by the Chemical Formula 1.

2. The molding film of claim 1 , having a transmittance as measured at 550 nm of 60% or more and 90% or less.

3. The molding film of claim 1 , wherein the cyclic aliphatic epoxy resin matrix includes a cyclic aliphatic epoxy resin containing a repeating unit represented by the Chemical Formula 3 and a repeating unit represented by the Chemical Formula 4, or a cured product thereof:

wherein, in the Chemical Formulae 3 and 4, C 4 to C 8 are each independently a cycloalkane having 3 to 10 carbon atoms, and L 3 to L 5 are each independently a direct bond or an alkylene group having 1 to 10 carbon atoms.

4. The molding film of claim 1 , wherein the content of the inorganic filler dispersed in the cyclic aliphatic epoxy resin matrix is 50% by weight or more and 90% by weight or less based on a total weight of the molding film.

Assignees

• Lg Chemical Ltd

Inventors

• Jeong Minsu
• Kyung You Jin
• Choi Byung Ju
• Jeong Woo Jae
• Lee Kwang Joo
• Cho Eunbyurl

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08K3/36

  Silica · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title