Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-12448490-B2 · Oct 21, 2025 · US
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Cho Eunbyurl patents
Cho Eunbyurl is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cho Eunbyurl |
| Total patents | 7 |
| First publication | Nov 5, 2020 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Non-conductive film, semiconductor device and manufacturing method of the same
US-2025279385-A1 · Sep 4, 2025 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-2023295388-A1 · Sep 21, 2023 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-11702520-B2 · Jul 18, 2023 · US
Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same
US-11515245-B2 · Nov 29, 2022 · US
Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same
US-2020395288-A1 · Dec 17, 2020 · US
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
US-2020347194-A1 · Nov 5, 2020 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lg Chemical Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/473 | 5 |
| C08G59/3218 | 5 |
| H01L23/295 | 5 |
| H10W42/121 | 4 |
| C09D163/00 | 4 |