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Patent family 67512078

This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.

Patent family metadata
Field	Value
Family ID	67512078
Family type	—
Earliest priority	Jan 11, 2018
First filing country	US
Member publications	4
Countries	US
Representative publication	US12448490B2 — Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

Representative publication

Best representative member for this family based on priority and filing country.

US12448490B2 — Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same (published Oct 21, 2025)

Related publications in this family.