Micro-electro-mechanical systems (MEMS) microphone assembly

Patent metadata

Field	Value
Publication number	US-12439188-B2
Application number	US-202017919839-A
Country	US
Kind code	B2
Filing date	Apr 22, 2020
Priority date	Apr 22, 2020
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

In at least one embodiment, a microphone assembly including an enclosure, a first printed circuit board (PCB) and a microphone assembly is provided. The microphone assembly includes a sub-casing, a micro-electro-mechanical systems (MEMS) transducer, and a second PCB. The MEMS transducer positioned in the sub-casing and the second PCB supports the MEMS transducer. The first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer. The second PCB defines a first audio port positioned directly below the MEMS transducer. The enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer. The enclosure defines a second acoustic opening that is positioned at a distance of between 3 to 30 mm from the first acoustic opening.

First claim

What is claimed is:

1. A microphone assembly comprising:
an enclosure;
a first printed circuit board (PCB); and
a microphone sub-assembly including:
a sub-casing;
a micro-electro-mechanical systems (MEMS) transducer positioned in the sub-casing; and
a second PCB to support the MEMS transducer,

wherein the second PCB defines a first audio port positioned directly below the MEMS transducer;
wherein the first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer and axially aligned with the first audio port and;
wherein the enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer;
wherein the enclosure defines a second acoustic opening that is positioned at a distance of between 3 to 30 mm from the first acoustic opening; and
wherein the sub-casing defines at least one port hole positioned on a top side thereof, and wherein the enclosure includes a post positioned over the at least one port hole to seal the sub-casing.

2. The microphone assembly of claim 1 , wherein the first acoustic opening and the second acoustic opening are positioned on a same surface of the enclosure.

3. The microphone assembly of claim 1 , wherein the first acoustic opening and the second acoustic opening are positioned on different surfaces of the enclosure.

4. The microphone assembly of claim 1 further comprising a first acoustic resistance positioned about the first acoustic opening and a second acoustic resistance positioned about the second acoustic opening.

5. The microphone assembly of claim 1 , wherein the at least one port hole includes a plurality of port holes spaced apart from one another on a top-side of the sub-casing.

6. The microphone assembly of claim 1 , wherein the post extends from the top side of the sub-casing to an underside of a top side of the enclosure.

7. The microphone assembly of claim 1 , further comprising a cover positioned on a top side of the sub-casing.

8. The microphone assembly of claim 7 , wherein the cover slides relative to the at least one port hole to provide a plurality of frequency responses for the assembly.

9. A microphone assembly comprising:
an enclosure;
a first printed circuit board (PCB);
a post; and
a microphone sub-assembly including:
a sub-casing;
a micro-electro-mechanical systems (MEMS) transducer positioned in the sub-casing to receive an audio input signal; and
at least one port hole positioned on a top-side of the sub-casing;
wherein the post is positioned over the at least one port hole to seal the sub-casing.

10. The microphone assembly of claim 9 further comprising a second PCB to support the MEMS transducer and defining a first audio port.

11. The microphone assembly of claim 10 :
wherein the first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer; and
wherein the enclosure defines a first acoustic opening that is positioned directly below the first acoustic path and the first audio port to enable the audio input signal to pass through the first audio port and to an underside of the MEMS transducer.

12. The microphone assembly of claim 11 , wherein the enclosure defines a second acoustic opening to enable the audio input signal to pass to a topside of the MEMS transducer.

13. The microphone assembly of claim 12 , wherein the second acoustic opening is positioned at a distance of between 3 to 30 mm from the first acoustic opening to increase sensitivity of the MEMS transducer and to minimize differences in sound pressure amplitudes of the audio input signal at the first acoustic opening and the second acoustic opening.

14. The microphone assembly of claim 11 , wherein the first acoustic opening and the second acoustic opening are positioned on a same surface of the enclosure.

15. The microphone assembly of claim 11 , wherein the first acoustic opening and the second acoustic opening are positioned on different surfaces of the enclosure.

16. The microphone assembly of claim 9 , wherein the post extends from the top-side of the sub-casing to an underside of a top side of the enclosure.

17. A microphone assembly comprising:
an enclosure;
a first printed circuit board (PCB); and
a microphone sub-assembly including:
a sub-casing;
a micro-electro-mechanical systems (MEMS) transducer positioned in the sub-casing to receive an audio input signal;
at least one port hole positioned on a top-side of the sub-casing; and
a cover positioned over the at least one port hole and being moveable about the at least one port hole to provide a plurality of frequency responses based on a location of the cover relative to the at least one port hole.

18. The microphone assembly of claim 17 , wherein the cover slides relative to the at least one port hole to provide the plurality of frequency responses.

Assignees

• Harman Int Ind

Inventors

• Du Yu

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R1/083

  Special constructions of mouthpieces · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title