Gradient micro-electro-mechanical systems (MEMS) microphone with varying height assemblies

Patent metadata

Field	Value
Publication number	US-9955246-B2
Application number	US-201414323595-A
Country	US
Kind code	B2
Filing date	Jul 3, 2014
Priority date	Jul 3, 2014
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (MEMS) transducer, a substrate layer, and an application housing. The single MEMS transducer is positioned within the enclosure. The substrate layer supports the single MEMS transducer. The application housing supports the substrate layer and defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

First claim

What is claimed is:

1. A micro-electro-mechanical systems (MEMS) microphone assembly comprising:
an enclosure;
a single micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure; and
a substrate layer to support the single MEMS transducer; and
an application housing to support the substrate layer, the application housing defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal,
wherein the application housing is one of a handset housing, a headset housing, and a speaker phone housing that defines the at least the portion of the transmission mechanism and the at least the portion of the second transmission mechanism, and
wherein the application housing includes a curved section to enable an overall length of the at least the portion of the first transmission mechanism to be greater than an overall length of the at least the portion of the second transmission mechanism.

2. The microphone assembly of claim 1 wherein the enclosure includes a base that defines a first acoustic port to enable the first side of the single MEMS transducer to receive the audio input signal and a second acoustic port to enable the second side of the single MEMS transducer to receive the audio input signal.

3. The microphone assembly of claim 2 wherein the base includes a first acoustic resistance element positioned about the first acoustic port and a second acoustic resistance element positioned about the second acoustic port.

4. The microphone assembly of claim 1 wherein the application housing includes a wall to separate the at least the portion of the first transmission mechanism and the at least the portion of the second transmission mechanism.

5. The microphone assembly of claim 1 wherein the at least the portion of the first transmission mechanism includes a first sound aperture that is formed at the curved section and wherein the at least the portion of the second transmission mechanism includes a second sound aperture and wherein the first sound aperture is perpendicular to the second sound aperture.

6. The microphone assembly of claim 5 further comprising a first acoustic resistance element positioned in the first sound aperture and a second acoustic resistance element positioned in the second sound aperture.

7. A micro-electro-mechanical systems (MEMS) microphone assembly comprising:
an enclosure;
a single micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure; and
a base to support the single MEMS transducer; and
a coupling layer coupled to the base to attach the single MEMS transducer to an application housing, wherein the base, the coupling layer and the application housing define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal,
wherein the application housing is one of a handset housing, a headset housing, and a speaker phone housing that defines a first portion of the transmission mechanism and a first portion of the second transmission mechanism, and
wherein the application housing includes a curved section to enable an overall length of the at least the portion of the first transmission mechanism to be greater than an overall length of the at least the portion of the second transmission mechanism.

Assignees

• Harman Int Ind
• Harman Int Ind

Inventors

• Reese Marc
• Baumhauer John
• Li Fengyuan
• Iraclianos Spiro

Classifications

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/02

  Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075}) · CPC title

• H04R1/38

  in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone · CPC title