Gradient micro-electro-mechanical systems (MEMS) microphone

Patent metadata

Field	Value
Publication number	US-10154330-B2
Application number	US-201414147194-A
Country	US
Kind code	B2
Filing date	Jan 3, 2014
Priority date	Jul 3, 2013
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

First claim

What is claimed is:

1. A micro-electro-mechanical systems (MEMS) microphone assembly comprising:
an enclosure;
a single micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure; and
a first substrate layer and a second substrate layer to support the single MEMS transducer
wherein the first substrate layer and the second substrate layer define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal,
wherein the first substrate layer defines a first acoustic hole and a second acoustic hole extending through the first substrate layer
wherein the second substrate layer defines a first sound aperture and a second sound aperture extending through the second substrate layer,
wherein the first transmission mechanism includes a first acoustic tube, the first sound aperture, and the first acoustic hole,
wherein each of the first sound aperture and the first acoustic hole are laterally offset from one another,
wherein the first acoustic tube has a first longitudinal length that is greater than a longitudinal length of each of the first sound aperture and the first acoustic hole,
wherein the second transmission mechanism includes a second acoustic tube, the second sound aperture, and the second acoustic hole,
wherein each of the second sound aperture and the second acoustic hole are laterally offset from one another,
wherein the second acoustic tube has a second longitudinal length that is greater than a longitudinal length of each of the second sound aperture and the second acoustic hole,
wherein the first acoustic tube and the second acoustic tube extend longitudinally below the first substrate layer,
wherein a delay distance separates the first sound aperture from the second sound aperture, and
wherein the delay distance is longer than an overall length of the enclosure.

2. The microphone assembly of claim 1 :
wherein the enclosure defines a first acoustic port and a second acoustic port;
wherein the first acoustic port is acoustically coupled to the first transmission mechanism to enable the first side of the single MEMS transducer to receive the audio input signal; and
wherein the second acoustic port is acoustically coupled to the second transmission mechanism to enable the second side of the single MEMS transducer to receive the audio input signal.

3. The microphone assembly of claim 1 wherein the enclosure defines a first acoustic cavity on the first side of the single MEMS transducer and a second acoustic cavity on the second side of the single MEMS transducer, wherein the first transmission mechanism includes the first acoustic hole that is directly acoustically coupled with the first acoustic cavity; and wherein the second transmission mechanism includes the second acoustic hole that is directly acoustically coupled with the second acoustic cavity.

4. The microphone assembly of claim 1 wherein the first substrate layer is configured to electrically couple the single MEMS transducer to an end user circuit assembly.

5. The microphone assembly of claim 4 further including an electrical connector from the first substrate layer configured to electrically couple the single MEMS transducer to an end user circuit board of the end user circuit assembly.

6. The microphone assembly of claim 4 wherein the first substrate layer is configured to be surface mounted to an end user circuit board and the microphone assembly is a standalone package.

7. The microphone assembly of claim 4 wherein the first substrate layer includes a flexible portion.

8. The microphone assembly of claim 1 wherein the microphone assembly is formed of a surface mount technology (SMT) standalone package for being received on an end user circuit board.

9. The microphone assembly of claim 8 wherein the SMT standalone package includes a plurality of electrical legs configured to electrically communicate with a plurality of electrical contacts on the end user circuit board.

10. The microphone assembly of claim 1 wherein the first substrate layer and the second substrate layer include shared electrical routing configured to enable electrical communication with an end user circuit board.

11. The microphone assembly of claim 1 further comprising a first acoustic resistance element including a first resistance value positioned about the first transmission mechanism and a second acoustic resistance element including a second resistance value positioned about the second transmission mechanism.

12. The microphone assembly of claim 11 wherein the second resistance value is greater than three times the first resistance value.

13. The microphone assembly of claim 1 further comprising at least one coupling layer configured to couple the microphone assembly to an end user housing.

14. The microphone assembly of claim 1 wherein the first substrate layer includes a flexible portion to form an angle of at least ninety degrees for enabling the microphone assembly to be surface mount coupled to an end user circuit board.

15. The microphone assembly of claim 1 wherein the first acoustic tube and the second acoustic tube extend longitudinally below the first substrate layer and the single MEMS transducer.

16. The microphone assembly of claim 1 further comprising a first acoustic seal positioned between the first substrate layer and the second substrate layer to prevent the audio input signal from leaking from the first acoustic tube and the second acoustic tube.

17. The microphone assembly of claim 1 wherein the delay distance at least partly increases an amount of time the audio input signal enters into the first sound aperture as opposed to the second sound aperture.

18. A micro-electro-mechanical systems (MEMS) microphone assembly comprising:
an enclosure;
only one micro-electro-mechanical systems (MEMS) transducer positioned within the enclosure; and
a plurality of substrate layers including a first substrate layer and a second substrate layer to support the only one MEMS transducer,
wherein the first substrate layer is configured to electrically couple the only one MEMS transducer to an end user circuit board;
wherein the plurality of substrate layers define at least one transmission mechanism that is acoustically coupled to the only one MEMS transducer to enable an audio input signal to pass to the only one MEMS transducer;
wherein the first substrate layer defines a first acoustic hole and a second acoustic hole extending through the first substrate layer,
wherein the second substrate layer defines a first sound aperture and a second sound aperture extending through the second substrate layer,
wherein the at least one transmission mechanism includes a first transmission mechanism and a second transmission mechanism;
wherein the first transmission mechanism includes a first acoustic tube, the first sound aperture, and the first acoustic hole,
wherein each of the first sound aperture and the first acoustic hole are laterally offset from one another,
wherein the first acoustic tube has a first longitudinal length that is greater than a longitudinal length of the first sound aperture and the first acoustic hole,
wherein each of the first sound aperture and the first acoustic hole are laterally offset from one another,
wherein the second transmission mechanism includes a second acoustic tube, a second sound aperture, and the second acoustic hole,
wherein the seco

Assignees

• Harman Int Ind
• Harman Int Ind

Inventors

• Baumhauer Jr John C
• Li Fengyuan
• Marcus Larry A
• Michel Alan D
• Reese Marc

Classifications

• H04R19/005 Primary

  using semiconductor materials · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/38

  in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone · CPC title

• H04R1/04 Primary

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title