Plasma processing method and plasma processing apparatus

Patent metadata

Field	Value
Publication number	US-12437970-B2
Application number	US-202318448077-A
Country	US
Kind code	B2
Filing date	Aug 10, 2023
Priority date	May 28, 2019
Publication date	Oct 7, 2025
Grant date	Oct 7, 2025

Abstract

A plasma processing method according to an exemplary embodiment includes applying a first direct-current voltage to a lower electrode of a substrate support provided in a chamber of a plasma processing apparatus, in a first period during generation of plasma in the chamber. The plasma processing method further includes applying a second direct-current voltage to the lower electrode in a second period different from the first period during generation of plasma in the chamber. The second direct-current voltage has a level different from a level of the first direct-current voltage. The second direct-current voltage has a same polarity as a polarity of the first direct-current voltage.

First claim

What is claimed is:

1. A plasma processing apparatus comprising:
a plasma processing chamber;
a substrate support disposed in the plasma processing chamber;
a first DC power source configured to generate a first DC voltage having a first voltage level;
a second DC power source configured to generate a second DC voltage having a second voltage level different from the first voltage level, the second DC voltage having a same polarity as a polarity of the first DC voltage;
a first switch configured to switch between a first conduction state and a first non-conduction state, the substrate support being connected to the first DC power source in the first conduction state and disconnected from the first DC power source in the first non-conduction state;
a second switch configured to switch between a second conduction state and a second non-conduction state, the substrate support being connected to the second DC power source in the second conduction state and disconnected from the second DC power source in the second non-conduction state;
a third switch configured to switch between a third conduction state and a third non-conduction state, the substrate support being connected to a reference potential in the third conduction state and disconnected from the reference potential in the third non-conduction state; and
a controller configured to cause:
the first conduction state of the first switch and the second non-conduction state of the second switch during a first period of a repeating sequence; and
the first non-conduction state of the first switch and the second conduction state of the second switch during a second period of the repeating sequence,

wherein the controller is configured to control the first switch, the second switch and the third switch to cause:
the first conduction state, the second non-conduction state and the third non-conduction state during the first period of the repeating sequence;
the first non-conduction state, the second conduction state and the third non-conduction state during the second period of the repeating sequence; and
the first non-conduction state, the second non-conduction state and the third conduction state during a third period of the repeating sequence between the first period and the second period.

2. The plasma processing apparatus according to claim 1 , wherein the controller is configured to control the first switch, the second switch and the third switch to cause the first non-conduction state, the second non-conduction state and the third conduction state during a fourth period of the repeating sequence subsequent to the second period.

3. The plasma processing apparatus according to claim 2 , wherein an absolute value of the reference potential is less than an absolute value of the first voltage level and an absolute value of the second voltage level.

4. The plasma processing apparatus according to claim 3 , wherein the reference potential is a ground potential.

5. The plasma processing apparatus according to claim 4 , wherein the first DC voltage and the second DC voltage have a negative polarity.

6. A plasma processing apparatus comprising:
a plasma processing chamber;
a substrate support disposed in the plasma processing chamber;
a power supply system configured to apply a first DC voltage to the substrate support during a first period of a repeating sequence, and apply a second DC voltage to the substrate support during a second period of the repeating sequence, the first DC voltage having a first voltage level, the second DC voltage having a second voltage level different from the first voltage level,
wherein the power supply system is configured to connect the substrate support to a reference potential during a third period of the repeating sequence between the first period and the second period,
wherein the power supply system is configured to connect the substrate support to the reference potential during a fourth period of the repeating sequence subsequent to the second period, and
wherein an absolute value of the reference potential is less than an absolute value of the first voltage level and an absolute value of the second voltage level.

7. The plasma processing apparatus according to claim 6 , wherein the reference potential is a ground potential.

8. The plasma processing apparatus according to claim 7 , wherein the first DC voltage and the second DC voltage have a negative polarity.

9. The plasma processing apparatus according to claim 6 , wherein the power supply system includes:
a switch configured to switch between a conduction state and a non-conduction state, the substrate support being connected to the reference potential in the conduction state and disconnected from the reference potential in the non-conduction state; and
a controller configured to control the switch to cause the non-conduction state during the first and second periods of the repeating sequence, and the conduction state during the third and fourth periods of the repeating sequence.

10. A plasma processing apparatus comprising:
a plasma processing chamber;
a substrate support disposed in the plasma processing chamber;
a DC power source configured to generate a DC voltage;
a first switch configured to switch between a first conduction state and a first non-conduction state, the substrate support being connected to the DC power source in the first conduction state and disconnected from the DC power source in the first non-conduction state;
a second switch configured to switch between a second conduction state and a second non-conduction state, the substrate support being connected to a reference potential in the second conduction state and disconnected from the reference potential in the second non-conduction state; and
a controller configured to cause:
maintaining, during a first period, the first conduction state of the first switch and the second non-conduction state of the second switch so as to increase a potential of the substrate support; and
maintaining, during a second period, the first non-conduction state of the first switch and the second conduction state of the second switch so as to decrease the potential of the substrate support,

wherein the first period and the second period are repeated in an alternating manner so as to transition from the first period to the second period before the substrate support is reached to a maximum potential.

11. The plasma processing apparatus according to claim 10 , wherein the controller is configured to cause:
maintaining, during a third period, the first conduction state of the first switch and the second non-conduction state of the second switch until the substrate support is reached to the maximum potential.

12. The plasma processing apparatus according to claim 10 , wherein the first period is less than the second period.

13. The plasma processing apparatus according to claim 12 , wherein the DC voltage has a first voltage level, an absolute value of the reference potential is less than an absolute value of the first voltage level.

14. The plasma processing apparatus according to claim 13 , wherein the reference potential is a ground potential.

15. The plasma processing apparatus according to claim 14 , wherein the DC voltage has a negative polarity.

Assignees

• Tokyo Electron Ltd

Inventors

• Koshimizu Chishio
• Hirotsu Shin
• Ikeda Takenobu
• Nagami Koichi
• Himori Shinji

Classifications

• H01H1/46

  self-aligning contacts · CPC title

• H05H1/01

  Handling plasma, e.g. of subatomic particles · CPC title

• H01J37/32568

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/32715 Primary

  Workpiece holder · CPC title

• H01J37/32577

  Electrical connecting means · CPC title