Systems for selectively feeding chunk polysilicon or granular polysilicon in a crystal growth chamber
US-11085126-B2 · Aug 10, 2021 · US
US12428750B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12428750-B2 |
| Application number | US-202318163635-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 2, 2023 |
| Priority date | Feb 25, 2022 |
| Publication date | Sep 30, 2025 |
| Grant date | Sep 30, 2025 |
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Ingot puller apparatus that include a silicon feed tube for adding solid silicon to a crucible assembly are disclosed. The silicon feed tubes include a conduit portion having an inner diameter and a kick plate disposed below the conduit portion. The kick plate extends across at least 60% of the inner diameter of the conduit portion.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a single crystal silicon ingot, the method comprising: adding a solid-phase silicon charge to a crucible disposed within a growth chamber; melting the solid-phase silicon charge to form an initial melt, the initial melt having a surface; lowering a silicon feed tube into the growth chamber, the silicon feed tube comprising: a conduit portion having an inner diameter; and a kick plate extending from and disposed below the conduit portion, the kick plate extending from 60% to 90% of the inner diameter of the conduit portion; adding additional solid-phase silicon to the initial melt through the silicon feed tube, the additional solid-phase silicon being chunk solid-phase silicon, the additional solid-phase silicon collecting on the surface of the initial melt and forming an island having a volcano shape; removing the silicon feed tube from the growth chamber; melting the island of additional solid-phase silicon to increase the size of the melt; lowering a seed crystal to contact the surface of the melt; and and raising the seed crystal to form a single crystal silicon ingot. 2. The method as set forth in claim 1 wherein the kick plate extends across from 70% to 90% of the inner diameter of the conduit portion. 3. The method as set forth in claim 1 wherein the silicon feed tube comprises a longitudinal axis, the kick plate and longitudinal axis forming an angle between 20° and 60°. 4. The method as set forth in claim 1 wherein the kick plate has a height, wherein the conduit portion overlaps less than 70% of the height of the kick plate. 5. The method as set forth in claim 1 wherein the silicon feed tube and single crystal silicon ingot move along a common axis. 6. A method for manufacturing a single crystal silicon ingot, the method comprising: adding a solid-phase silicon charge to a crucible disposed within a growth chamber; melting the solid-phase silicon charge to form an initial melt, the initial melt having a surface; lowering a silicon feed tube into the growth chamber, the silicon feed tube comprising: a conduit portion having an inner diameter; and a kick plate extending from and disposed below the conduit portion, the kick plate extending from 60% to 90% of the inner diameter of the conduit portion; adding additional solid-phase silicon to the initial melt through the silicon feed tube, the additional solid-phase silicon being chunk solid-phase silicon, the additional solid-phase silicon collecting on the surface of the initial melt; removing the silicon feed tube from the growth chamber; melting the island of additional solid-phase silicon to increase the size of the melt; lowering a seed crystal to contact the surface of the melt; and and raising the seed crystal to form a single crystal silicon ingot, the silicon feed tube and single crystal silicon ingot moving along a common axis. 7. The method as set forth in claim 6 wherein the kick plate extends across from 70% to 90% of the inner diameter of the conduit portion. 8. The method as set forth in claim 6 wherein the silicon feed tube comprises a longitudinal axis, the kick plate and longitudinal axis forming an angle between 20° and 60°. 9. The method as set forth in claim 6 wherein the kick plate has a height, wherein the conduit portion overlaps less than 70% of the height of the kick plate.
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