Vacuum assisted filtration

Patent metadata

Field	Value
Publication number	US-12427451-B2
Application number	US-202418411963-A
Country	US
Kind code	B2
Filing date	Jan 12, 2024
Priority date	Feb 12, 2020
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

A method of supplying a processing solution includes shutting off a feed line supplying the processing solution to a chemical filter, installing a dry chemical filter in a filter housing of the chemical filter, closing an output line from the filter housing to a nozzle configured to dispense the processing solution (either before or after installing the dry chemical filter), applying a vacuum to the filter housing while the feed line remains shut, and opening the feed line while locking in the vacuum within the filter housing. Shutting off the feed line and closing the output line may be accomplished by closing respective valves. Before installing the dry filter, a valve to the vacuum may be closed. The method may be performed by a processor executing a program stored in a non-transitory computer-readable medium.

First claim

What is claimed is:

1. A method of installing a dry chemical filter used to supply a processing solution, the method comprising:
shutting off a feed line supplying the processing solution to a chemical filter;
closing an output line from a filter housing to a nozzle configured to dispense the processing solution;
while the feed line and the output line remain shut,
installing the dry chemical filter in the filter housing of the chemical filter, and
applying a vacuum to the filter housing;

closing off the dry chemical filter and the filter housing from the vacuum to lock in the vacuum; and
opening the feed line while locking in the vacuum within the filter housing.

2. The method of claim 1 , wherein the vacuum is applied directly to the filter housing while the feed line remains shut.

3. The method of claim 1 , further comprising removing a used chemical filter from the filter housing before installing the dry chemical filter.

4. The method of claim 1 , further comprising depressurizing the processing solution before applying the vacuum.

5. The method of claim 4 , wherein depressurizing the processing solution comprises reducing the pressure from about 250 Torr to about 50 Torr.

6. The method of claim 1 , wherein the processing solution comprises chemicals for a photolithography process, wet cleaning process, deposition process liquid precursor, or etching process liquid precursor.

7. The method of claim 1 , wherein installing the chemical filter in the filter housing comprises installing a dry chemical filter that is devoid of liquid chemicals before the installing.

8. The method of claim 1 , wherein applying the vacuum to the filter housing comprises reaching a pressure inside the filter housing between about 10 mTorr and about 500 mTorr before opening the feed line.

9. The method of claim 1 , further comprising:
monitoring pressure inside the filter housing until reaching a steady-state pressure, wherein opening the feed line comprises opening the feed line in response to reaching the steady-state pressure.

10. The method of claim 1 , further comprising processing a semiconductor wafer with the processing solution dispensed from the nozzle.

11. The method of claim 1 , further comprising:
closing a feed valve between the feed line and the chemical filter to shut off the feed line;
closing a vacuum valve between the vacuum and the chemical filter;
closing a dispense valve between the output line and the chemical filter; and
locking in the vacuum within the filter housing by closing the vacuum valve,
wherein installing the dry chemical filter and applying the vacuum to the filter housing are performed while the feed valve, the vacuum valve, and the dispense valve remain closed.

12. The method of claim 11 , wherein the vacuum is applied directly to the filter housing while the feed valve, the vacuum valve, and the dispense valve remain closed.

13. A method of installing a dry chemical filter used to supply a processing solution, the method comprising:
shutting off a feed line supplying the processing solution to a chemical filter;
closing an output line from a filter housing to a nozzle configured to dispense the processing solution;
while the feed line and the output line remain shut,
installing the dry chemical filter in the filter housing of the chemical filter,
applying a vacuum directly to the filter housing, and
monitoring pressure inside the filter housing until reaching a steady-state pressure; and

in response to reaching the steady-state pressure,
closing off the dry chemical filter and the filter housing from the vacuum to lock in the vacuum, and
opening the feed line while locking in the vacuum within the filter housing.

Assignees

• Tokyo Electron Ltd

Inventors

• Lemley Corey

Classifications

• B01D2201/54

  Computerised or programmable systems · CPC title

• B01D36/001 Primary

  Filters in combination with devices for the removal of gas, air purge systems · CPC title

• B01D2201/204

  Systems for applying vacuum to filters · CPC title

• B01D2201/165

  Multi-way valves · CPC title

• B01D2221/14

  Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues · CPC title