Deflectable platens and associated methods

Patent metadata

Field	Value
Publication number	US-12424452-B2
Application number	US-202217683479-A
Country	US
Kind code	B2
Filing date	Mar 1, 2022
Priority date	Oct 18, 2019
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.

First claim

The invention claimed is:

1. A method of deflecting a platen comprising:
providing a first layer formed of a material having a first coefficient of thermal expansion (CTE);
providing a second layer formed of a material having a second CTE bonded to, and in directed contact with, the first layer, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE; and
activating a heat trace disposed between the first layer and the second layer to heat the first layer and the second layer to a temperature in a range of 200 degrees Celsius to 600 degrees Celsius, wherein the heat trace is disposed entirely between, and is in direct contact with, the first layer and the second layer.

2. The method of claim 1 , wherein the second CTE is greater than the first CTE.

3. The method of claim 2 , wherein the first CTE is between 2.0×10 −7 /° C. and 4.0×10 −7 /° C., and the second CTE is between 6.0×10 −7 /° C. and 8.0×10 −7 /° C.

4. The method of claim 2 , wherein the first layer is formed of at least one of quartz, carbon, silicon, silicon nitride, silicon carbide, aluminum nitride, INVAR, KOVAR, molybdenum, tungsten, tantalum, and titanium.

5. The method of claim 2 , wherein the second layer is formed of at least one of ceramic, aluminum, silver, and copper.

6. The method of claim 1 , wherein the heat trace comprises at least one of a wire, a cable, a plate, and a tape connected to a source of electrical power.

7. The method of claim 1 , wherein the first CTE is greater than the second CTE.

8. The method of claim 7 , wherein the second CTE is between 2.0×10 −7 /° C. and 4.0×10 −7 /° C., and the first CTE is between 6.0×10 −7 /° C. and 8.0×10 −7 /° C.

Assignees

• Applied Materials Inc

Inventors

• Yin Ming
• Sun Dawei

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P90/1914

  using bonding · CPC title

• H10P95/90 Primary

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7611 Primary

  characterised by edge profile or support profile · CPC title