Integrated circuit having current-sensing coil

Patent metadata

Field	Value
Publication number	US-12424381-B2
Application number	US-202418737078-A
Country	US
Kind code	B2
Filing date	Jun 7, 2024
Priority date	Mar 13, 2015
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An integrated circuit includes a first conductive path over a substrate, a coil structure over the substrate, and a ferromagnetic ring. The first conductive path is configured to generate a first time-varying magnetic field based on a first time-varying current. The coil structure is configured to generate an induced electrical potential responsive to the first time-varying magnetic field. The ferromagnetic ring includes an open portion. The first conductive path extending through the open portion of the ferromagnetic ring. The first conductive path includes a first conductive line on a first level that is below the ferromagnetic ring, a second conductive line on a second level that is above the ferromagnetic ring, and a first via on a third level that is coplanar with the ferromagnetic ring, the first via electrically coupling the first conductive line and the second conductive line together.

First claim

What is claimed is:

1. An integrated circuit, comprising:
a first conductive path over a substrate, the first conductive path being configured to generate a first time-varying magnetic field based on a first time-varying current;
a coil structure over the substrate, the coil structure being configured to generate an induced electrical potential responsive to the first time-varying magnetic field; and
a ferromagnetic ring including an open portion, the first conductive path extending through the open portion of the ferromagnetic ring, the first conductive path comprises:
a first conductive line on a first level that is below the ferromagnetic ring;
a second conductive line on a second level that is above the ferromagnetic ring; and
a first via on a third level that is coplanar with the ferromagnetic ring, the first via electrically coupling the first conductive line and the second conductive line together.

2. The integrated circuit of claim 1 , wherein the coil structure is wrapped around the ferromagnetic ring by a number of turns.

3. The integrated circuit of claim 1 , further comprising:
a first interconnect layer over the substrate,
wherein the coil structure is in the first interconnect layer.

4. The integrated circuit of claim 3 , further comprising:
a second interconnect layer over the first interconnect layer,
wherein the second conductive line is a portion of the second interconnect layer.

5. The integrated circuit of claim 1 , wherein the ferromagnetic ring comprises:
a first portion extending in a first direction;
a second portion extending in a second direction different from the first direction, wherein a first end of the second portion is coupled to a first end of the first portion;
a third portion extending in the first direction, wherein a first end of the third portion is coupled to a second end of the second portion; and
a fourth portion extending in the second direction, wherein a first end of the fourth portion is coupled to a second end of the third portion, and a second end of the fourth portion is coupled to a second end of the first portion.

6. The integrated circuit of claim 5 , wherein
the first conductive line is below the fourth portion of the ferromagnetic ring; and
the second conductive line is above the second portion of the ferromagnetic ring.

7. The integrated circuit of claim 1 , further comprising:
a first interconnect layer over the substrate, the ferromagnetic ring being over the first interconnect layer; and
a second interconnect layer over the substrate, the second interconnect layer being over the ferromagnetic ring,
wherein the coil structure comprises:
a first set of conductive lines in the first interconnect layer; and
a second set of conductive lines in the second interconnect layer.

8. The integrated circuit of claim 7 , further comprising:
a passivation layer over the first interconnect layer, the ferromagnetic ring being over the passivation layer.

9. The integrated circuit of claim 7 , wherein
the first level is the first interconnect layer; and the second level is the second interconnect layer.

10. The integrated circuit of claim 1 , wherein
the first conductive path is a portion of an interconnect layer over the substrate.

11. The integrated circuit of claim 1 , wherein
the second conductive line is a bond wire or a ball bond over the substrate.

12. An integrated circuit, comprising:
a ferromagnetic structure over a substrate, the ferromagnetic structure having a first ferromagnetic portion extending along a first direction, and a second ferromagnetic portion extending along the first direction and being separated from the first ferromagnetic portion in a second direction different from the first direction;
a first conductive path over the substrate, the first conductive path being adjacent to the first ferromagnetic portion and the second ferromagnetic portion and extends along the second direction, the first conductive path comprising:
a first conductive line in a first interconnect layer under the ferromagnetic structure;
a second conductive line in a second interconnect layer over the ferromagnetic structure; and
a first via coplanar with the ferromagnetic structure, the first via electrically coupling the first conductive line in the first interconnect layer and the second conductive line in the second interconnect layer;
a second conductive path over the substrate, the second conductive path being adjacent to the first conductive path, the first ferromagnetic portion and the second ferromagnetic portion, and extending along the second direction;
a third conductive path over the substrate, the third conductive path being adjacent to the first ferromagnetic portion, the second ferromagnetic portion and one of the first conductive path or the second conductive path, and extending along the second direction; and
a coil structure over the substrate, the coil structure being wrapped around the ferromagnetic structure.

13. The integrated circuit of claim 12 , wherein the second conductive path comprises:
a third conductive line in the first interconnect layer under the ferromagnetic structure;
a fourth conductive line in the second interconnect layer over the ferromagnetic structure; and
a second via coplanar with the ferromagnetic structure, the second via electrically coupling the third conductive line in the first interconnect layer and the fourth conductive line in the second interconnect layer.

14. The integrated circuit of claim 13 , wherein the third conductive path comprises:
a fifth conductive line in the first interconnect layer under the ferromagnetic structure;
a sixth conductive line in the second interconnect layer over the ferromagnetic structure; and
a third via coplanar with the ferromagnetic structure, the third via electrically coupling the fifth conductive line in the first interconnect layer and the sixth conductive line in the second interconnect layer.

15. The integrated circuit of claim 12 , further comprising:
a regulator circuit coupled to the first conductive path and the second conductive path.

16. The integrated circuit of claim 15 , wherein the regulator circuit comprises:
a control circuit configured to generate a control signal;
a first driver circuit coupled to the control circuit, and configured to receive the control signal;
a second driver circuit coupled to the control circuit, and configured to receive the control signal;
an inductor coupled to the first driver circuit and the second driver circuit;
an output node coupled to the inductor; and
a decoupling capacitor coupled to the output node, the inductor and a reference voltage node.

17. The integrated circuit of claim 12 , wherein the coil structure comprises:
a first set of conductive lines in the first interconnect layer; and
a second set of conductive lines in the second interconnect layer,
wherein the first interconnect layer is over the substrate, the ferromagnetic structure is over the first interconnect layer, the second interconnect layer is over the substrate, and the second interconnect layer is over the ferromagnetic structure.

18. The integrated circuit of claim 12 , wherein the ferromagnetic structure comprises a material including cobalt, zirconium, or tantalum.

19. The integrated circuit of claim 12 , wherein the ferromagnetic structure comprises a ferromagnetic ring.

20. A method of operating an integrated circuit, comprising:
generating a time-varying magnetic field based on a ti

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Roth Alan
• Soenen Eric

Classifications

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• H01F5/003

  Printed circuit coils · CPC title

• G01R15/183

  using transformers with a magnetic core · CPC title

• H10D1/20

  Inductors · CPC title

• H01F38/30 Primary

  Constructions · CPC title