Integrated circuit having current-sensing coil

Patent metadata

Field	Value
Publication number	US-11569030-B2
Application number	US-202017125020-A
Country	US
Kind code	B2
Filing date	Dec 17, 2020
Priority date	Mar 13, 2015
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

An integrated circuit includes a first and a second conductive path over a substrate, a coil structure over the substrate, a voltage sensing circuit electrically coupled with the coil structure, and a ferromagnetic structure including an open portion. The first conductive path is configured to carry a first time-varying current and to generate a first time-varying magnetic field. The second conductive path is configured to carry a second time-varying current and to generate a second time-varying magnetic field. The first conductive path and the second conductive path extend through the open portion of the ferromagnetic structure. The first conductive path includes a first conductive line below the ferromagnetic structure, a second conductive line above the ferromagnetic structure, and a first via plug coplanar with the ferromagnetic structure, the first via plug electrically coupling the first conductive line and the second conductive line.

First claim

What is claimed is:

1. An integrated circuit, comprising:
a first conductive path over a substrate, the first conductive path being configured to carry a first time-varying current and to generate a first time-varying magnetic field based on the first time-varying current;
a second conductive path over the substrate, the second conductive path being configured to carry a second time-varying current and to generate a second time-varying magnetic field based on the second time-varying current;
a coil structure over the substrate, the coil structure being magnetically coupled with the first conductive path and the second conductive path, and being configured to generate an induced electrical potential responsive to the first time-varying magnetic field and the second time-varying magnetic field;
a voltage sensing circuit electrically coupled with the coil structure and configured to measure a voltage level of the induced electrical potential; and
a ferromagnetic structure including an open portion, the first conductive path and the second conductive path extending through the open portion of the ferromagnetic structure, the first conductive path comprises:
a first conductive line below the ferromagnetic structure;
a second conductive line above the ferromagnetic structure; and
a first via plug coplanar with the ferromagnetic structure, the first via plug electrically coupling the first conductive line and the second conductive line.

2. The integrated circuit of claim 1 , wherein the second conductive path comprises:
a third conductive line below the ferromagnetic structure;
a fourth conductive line above the ferromagnetic structure; and
a second via plug coplanar with the ferromagnetic structure, the second via plug electrically coupling the third conductive line and the fourth conductive line.

3. The integrated circuit of claim 2 , further comprising:
a first interconnect layer over the substrate,
wherein the coil structure is in the first interconnect layer.

4. The integrated circuit of claim 3 , further comprising:
a second interconnect layer over the first interconnect layer,
wherein the second conductive line is a portion of the second interconnect layer and, the fourth conductive line is another portion of the second interconnect layer.

5. The integrated circuit of claim 1 , wherein
the first conductive path is a portion of an interconnect layer or a bond wire over the substrate; and
the second conductive path is another portion of the interconnect layer or the bond wire over the substrate.

6. The integrated circuit of claim 1 , further comprising:
a first interconnect layer over the substrate, the ferromagnetic structure being over the first interconnect layer; and
a second interconnect layer over the substrate, the second interconnect layer being over the ferromagnetic structure,
wherein the coil structure comprises:
a first set of conductive lines in the first interconnect layer; and
a second set of conductive lines in the second interconnect layer.

7. The integrated circuit of claim 6 , further comprising:
a passivation layer over the first interconnect layer, the ferromagnetic structure being over the passivation layer.

8. The integrated circuit of claim 6 , wherein
the ferromagnetic structure comprises a ferromagnetic ring, wherein
the first conductive line is in the first interconnect layer; and
the second conductive line is in the second interconnect layer.

9. The integrated circuit of claim 6 , wherein
the ferromagnetic structure comprises a ferromagnetic strip extending along a first direction;
the first conductive path extends along a second direction different from the first direction; and
the second conductive path extends along the second direction.

10. The integrated circuit of claim 1 , wherein the coil structure is wrapped around the ferromagnetic structure by a number of turns.

11. An integrated circuit, comprising:
a ferromagnetic structure over a substrate, the ferromagnetic structure having a first ferromagnetic portion extending along a first direction;
a first conductive path over the substrate, the first conductive path being adjacent to the first ferromagnetic portion of the ferromagnetic structure and extends along a second direction different from the first direction, the first conductive path comprises:
a first conductive line in a first interconnect layer under the ferromagnetic structure;
a second conductive line in a second interconnect layer over the ferromagnetic structure; and
a first via plug coplanar with the ferromagnetic structure, the first via plug electrically coupling the first conductive line in the first interconnect layer and the second conductive line in the second interconnect layer;

a second conductive path over the substrate, the second conductive path being adjacent to the first conductive path and the first ferromagnetic portion, and extending along the second direction; and
a coil structure over the substrate, the coil structure being wrapped around the ferromagnetic structure.

12. The integrated circuit of claim 11 , wherein the second conductive path comprises:
a third conductive line in the first interconnect layer under the ferromagnetic structure;
a fourth conductive line in the second interconnect layer over the ferromagnetic structure; and
a second via plug coplanar with the ferromagnetic structure, the second via plug electrically coupling the third conductive line in the first interconnect layer and the fourth conductive line in the second interconnect layer.

13. The integrated circuit of claim 11 , wherein the ferromagnetic structure comprises a ferromagnetic strip extending along the first direction.

14. The integrated circuit of claim 13 , wherein the coil structure comprises:
a first set of conductive lines in the first interconnect layer; and
a second set of conductive lines in the second interconnect layer,
wherein the first interconnect layer is over the substrate, the ferromagnetic structure is over the first interconnect layer, the second interconnect layer is over the substrate, and the second interconnect layer is over the ferromagnetic structure.

15. The integrated circuit of claim 11 , wherein the ferromagnetic structure comprises a ferromagnetic ring.

16. The integrated circuit of claim 11 , wherein the ferromagnetic structure comprises a material including cobalt, zirconium, or tantalum.

17. The integrated circuit of claim 11 , further comprising:
a regulator circuit coupled to the first conductive path and the second conductive path.

18. The integrated circuit of claim 17 , wherein the regulator circuit comprises:
a control circuit;
a first driver circuit coupled to the control circuit;
a second driver circuit coupled to the control circuit;
an inductor coupled to the first driver circuit and the second driver circuit;
a decoupling capacitor coupled to at least the inductor; and
an output node coupled to the inductor and the decoupling capacitor.

19. A method of operating an integrated circuit, comprising:
generating a time-varying magnetic field based on a time-varying current on a first conductive path of the integrated circuit or a second conductive path, the first conductive path and the second conductive path extending through an open portion of a ferromagnetic structure, the first conductive path comprises:
a first conductive line in a first interconnect layer under the ferromagnetic structure;
a second conductive line in a second interconnect layer over the ferro

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Roth Alan
• Soenen Eric

Classifications

• H01L23/5227

  Electricity · mapped topic

• H01F5/003

  Printed circuit coils · CPC title

• H01F38/30 Primary

  Constructions · CPC title

• G01R15/183

  using transformers with a magnetic core · CPC title

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title