Card element, chip card, and process for manufacturing a card element for a chip card

Patent metadata

Field	Value
Publication number	US-12423552-B2
Application number	US-202218552245-A
Country	US
Kind code	B2
Filing date	Mar 23, 2022
Priority date	Mar 25, 2021
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

A card element for a chip card, includes an outer metal layer with a flat surface interrupted only by a module opening for receiving a chip module. The module opening extends to an inner side and includes a ferrite layer located on the inner side and through which the opening extends. An inner metal layer is disposed on the ferrite layer through which a portion of the module opening has a reduced cross-section extends. A slit extends from a peripheral surface of the inner metal layer to the module opening and extends through the entire thickness of the inner metal layer. A final layer is made of plastic and disposed on the inner metal layer.

First claim

The invention claimed is:

1. A card body for a chip card, having:
an outer metal layer having a planar surface interrupted only by a module opening for receiving a chip module,
wherein the module opening extends to an inner side of the outer metal layer,
a ferrite layer disposed directly adjacent to the inner side of the outer metal layer, wherein the module opening extends through the ferrite layer,
an inner metal layer disposed directly adjacent to the ferrite layer, wherein the inner metal layer and outer metal layer comprise the same material,
wherein a portion of the module opening that has a reduced cross-section extends through the inner metal layer, and
wherein there is provided a slit which extends from a peripheral face of the inner metal layer to the module opening and which extends through the entire thickness of the inner metal layer, and
a final layer disposed directly adjacent to the inner metal layer and consisting of a plastic material.

2. The card body according to claim 1 , wherein the layers are bonded by means of an adhesive.

3. The card body according to claim 1 , wherein the final layer consists of multiple layers.

4. The card body according to claim 3 , wherein the final layer comprises an inner layer having visual features and an overlay layer.

5. The card body according to claim 1 , wherein the surface of the outer metal layer is covered with a plastics layer.

6. The card body according to claim 1 , wherein the module opening extends into the final layer.

7. A chip card comprising a card body according to claim 1 and a chip module, having a coil embedded in the module opening of the card body.

8. The chip card according to claim 7 , wherein the coil is arranged in a peripheral region of the module opening,
wherein the peripheral region is in the form of a shoulder at the transition between the module opening and the portion of the module opening that has a reduced cross-section.

9. A process for manufacturing a card body for a chip card, comprising the steps:
providing an inner metal layer having a slit extending from a peripheral face of the inner metal layer to a module opening region for the module opening that is subsequently to be produced and extends through the entire thickness of the inner metal layer,
disposing a ferrite layer directly adjacent to one side of the inner metal layer,
disposing an outer metal layer directly adjacent to the ferrite layer, wherein the inner metal layer and outer metal layer comprise the same material,
disposing a final layer consisting of a plastics material directly adjacent to a further side of the inner metal layer,
forming a module opening for receiving a chip module in the outer metal layer and through the inner metal layer,
wherein the module opening is formed with a reduced cross section in the inner metal layer.

Assignees

• Giesecke & Devrient Epayments Gmbh

Inventors

• Minks Andreas

Classifications

• G06K1/12

  otherwise than by punching · CPC title

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G06K19/07771 Primary

  the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title