Card having a fingerprint sensor and manufacturing method of the same
US-2023394269-A1 · Dec 7, 2023 · US
US2024070425A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024070425-A1 |
| Application number | US-202017766805-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 22, 2020 |
| Priority date | Oct 25, 2019 |
| Publication date | Feb 29, 2024 |
| Grant date | — |
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Metal transaction cards and methods of making metal transaction cards are disclosed. One metal transaction card includes at least one metal layer and an inlay layer comprising a biometric sensor and one or more payment interface components configured to interface with a card reader, a secure element configured to exchange information with the card reader pursuant to processing a financial transaction, and at least one logic component connected to the biometric sensor. The logic component is configured to compare information detected by the biometric sensor to stored information and to enable processing of the financial transaction only upon a detected match between the detected and stored information.
Opening claim text (preview).
1 . A metal transaction card comprising: at least one metal layer; a biometric sensor; one or more payment interface components configured to interface with a card reader; a secure element configured to exchange information with the card reader pursuant to processing a financial transaction; and at least one logic component connected to the biometric sensor and configured to compare information detected by the biometric sensor to stored information and to enable processing of the financial transaction only upon a detected match between the detected and stored information. 2 . The metal transaction card of claim 1 , wherein one or more the biometric sensor, the one or more payment interface components, the secure element, and the at least one logic component are disposed on an inlay. 3 . The metal transaction card of claim 2 , further comprising at least one non-metal layer disposed between a first surface of the inlay layer and the metal layer. 4 . The metal transaction card of claim 2 , further comprising at least one other layer assembled on a second surface of the inlay layer. 5 . The metal transaction card of claim 1 , wherein the one or more payment interface components comprises a set of physical contacts configured to interface with a card reader and accessible from a surface of the card. 6 . The metal transaction card of claim 1 , wherein the one or more payment interface components comprises one or more antennae configured for contactless communication with a card reader. 7 . The metal transaction card of claim 1 , wherein the one or more antennae is configured for contactless communication with a card reader in the nature of short-range wireless interconnection. 8 . The metal transaction card of claim 1 , wherein the one or more payment interface components comprises a dual interface chip comprising a set of physical contacts configured to interface with a card reader and accessible from a surface of the card, one or more antennae configured for contactless communication with a card reader, and the secure element in a single integrated payment module. 9 . The metal transaction card of claim 5 , wherein the at least one logic component further comprises the secure element connected to the set of physical contacts. 10 . The metal transaction card of claim 9 , wherein the at least one logic component comprises the secure element, a microprocessor configured to compare information detected by the biometric sensor to stored information, computer memory for storing the stored information, and one or more antennae configured for contactless communication with a card reader in a single integrated secure processing module. 11 . The metal transaction card of claim 1 , further comprising at least one opening in the metal layer. 12 . The metal transaction card of claim 11 , wherein the one or more payment interface components configured to interface with a card reader comprises contacts accessible through the at least one opening. 13 . The metal transaction card of claim 11 , wherein the biometric sensor is accessible through the at least one opening. 14 . The metal transaction card of claim 1 , wherein the biometric sensor is a fingerprint sensor. 15 . The metal transaction card of claim 1 , wherein the biometric sensor comprises an image capture device. 16 . The metal transaction card of claim 1 , wherein the biometric sensor is configured to detect a change in reflected radiation corresponding to biometric user information. 17 . The metal transaction card of claim 16 , wherein the biometric sensor is an ultrasonic fingerprint sensor. 18 . The metal transaction card of claim 16 , wherein the biometric sensor is not visible from an outer surface of the card. 19 . The metal transaction card of claim 18 , further comprising visible indicia on an outer surface of the card aligned with the biometric sensor to signify a lateral location of the sensor relative to a periphery of the card. 20 . A method for making a transaction card, the method comprising the steps of: (a) providing at least one metal layer; (b) providing at least one inlay layer comprising a biometric sensor, one or more payment interface components configured to interface with a card reader; a secure element configured to exchange information with the card reader pursuant to processing a financial transaction; and at least one logic component connected to the biometric sensor and configured to compare information detected by the biometric sensor to stored information and to enable processing of the financial transaction only upon a detected match between the detected and stored information; (a) assembling the card with the biometric sensor and the one or more payment interface components in communication with the inlay and configured to obtain transaction information and biometric information originating from a location on or above the metal layer. 21 . The method of claim 20 , further comprising the steps of: (d) providing at least one non-metal layer; (e) providing at least one other layer; (f) disposing the at least one non-metal layer between a first surface of the at least one inlay layer and the at least one metal layer and disposing the at least one other layer on a second surface of the at least one inlay layer. 22 . The method of claim 20 , further comprising creating one or more openings in the metal layer. 23 . The method of claim 22 , wherein the one or more payment interface components comprises a set of physical contacts configured to interface with a card reader and accessible from a surface of a finished card, and creating at least one opening in the metal layer aligned with the set of physical contacts. 24 . The method of claim 23 , comprising at least one non-conductive adhesive layer in contact with an underside of the at least one metal layer, wherein the non-conductive adhesive fills a peripheral gap between the opening in the metal layer and the one or more payment interface components, including the set of physical contacts, in a finished card, said non-conductive adhesive operable to isolate the one or more payment interface components from the metal layer electrically, magnetically, or a combination thereof. 25 . The method of claim 22 , comprising creating at least one opening in the metal layer aligned with the biometric sensor. 26 . The method of claim 25 , comprising at least one non-conductive adhesive layer in contact with an underside of the at least one metal layer, wherein the non-conductive adhesive fills a peripheral gap between the opening in the metal layer and the biometric sensor in a finished card, said non-conductive adhesive operable to isolate the biometric sensor from the metal layer electrically, magnetically, or a combination thereof. 27 . The method of claim 23 , comprising creating at least one opening in the metal layer aligned with the biometric sensor. 28 . The method of claim 27 , comprising at least one non-conductive adhesive layer in contact with an underside of the at least one metal layer, wherein the non-conductive adhesive fills a first peripheral gap between a first opening in the metal layer and the one or more payment interface components, including the set of physical contacts, and a second peripheral gap between a second opening in the metal layer and the biometric sensor in a finished ca
Active cards, i.e. cards including their own processing means, e.g. including an IC or chip · CPC title
characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title
the sensor being of the biometric kind, e.g. fingerprint sensors (fingerprint sensors in general G06V40/13; biometric access-control systems in general, see G07C9/00) · CPC title
comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title
the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title
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