Chip card

Patent metadata

Field	Value
Publication number	US-11030513-B2
Application number	US-201916691623-A
Country	US
Kind code	B2
Filing date	Nov 22, 2019
Priority date	Nov 23, 2018
Publication date	Jun 8, 2021
Grant date	Jun 8, 2021

Abstract

A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

First claim

What is claimed is:

1. A chip card, comprising:
a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer;
a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module; and
the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

2. The chip card of claim 1 ,
wherein the booster antenna structure is formed by an etched metal.

3. The chip card of claim 1 ,
wherein the booster antenna structure is formed on a flexprint substrate.

4. The chip card of claim 1 ,
wherein the booster antenna structure is formed by a wire.

5. The chip card of claim 1 ,
wherein the booster antenna structure is formed by a punched metal.

6. The chip card of claim 1 ,
wherein the metal of the booster antenna structure is a metal selected from a group consisting of:
aluminum;
silver;
copper; and
an alloy of at least one of the metals listed above.

7. The chip card of claim 1 ,
wherein the booster antenna structure has at least one antenna turn;
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 500 μm.

8. The chip card of claim 7 ,
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 300 μm.

9. The chip card of claim 8 ,
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 200 μm.

10. The chip card of claim 9 ,
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 100 μm.

11. The chip card of claim 1 ,
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is in a range from approximately 50 μm to approximately 500 μm.

12. The chip card of claim 11 ,
wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is in a range from approximately 100 μm to approximately 300 μm.

13. The chip card of claim 1 ,
wherein the metal layer has a thickness that is substantially equal to the total thickness of the chip card.

14. The chip card of claim 1 , further comprising:
a support;
wherein the metal layer is arranged above the support;
wherein the support has a cutout in which the chip module is arranged.

15. The chip card of claim 1 ,
wherein the metal layer is laminated with at least one additional layer.

16. The chip card of claim 1 ,
wherein the metal layer has a thickness that is at least 90% of the total thickness of the chip card.

17. The chip card of claim 1 ,
wherein the booster antenna structure, the metal layer and the antenna structure of the chip module are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the metal layer is less than the electromagnetic coupling between the booster antenna structure and the antenna structure of the chip module.

18. The chip card of claim 1 ,
wherein the booster antenna structure and the metal layer are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the metal layer has a coupling factor in a range from approximately 0.05 to approximately 0.35.

19. The chip card of claim 1 ,
wherein the booster antenna structure and the antenna structure of the chip module are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the antenna structure of the chip module has a coupling factor in a range from approximately 0.3 to approximately 0.9.

20. The chip card of claim 1 ,
wherein the metal layer has a weight that is at least 90% of the total weight of the chip card.

Assignees

• Infineon Technologies Ag

Inventors

• Pachler Walther
• Gruber Josef
• Hoelzl Juergen
• Poensgen Francois
• Rampetzreiter Stephan

Classifications

• G07F7/084

  Additional components relating to data transfer and storing, e.g. error detection, self-diagnosis · CPC title

• G06Q20/352

  Contactless payments by cards · CPC title

• G06K19/02

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

• G06K19/07794 Primary

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/07773

  Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title