High-density power supply

Patent metadata

Field	Value
Publication number	US-12419016-B2
Application number	US-202318163900-A
Country	US
Kind code	B2
Filing date	Feb 3, 2023
Priority date	Feb 15, 2022
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A high-density power supply includes a shell, a fan, a PFC module, a DC-DC module and a main board. The shell has a first air passage and a second air passage arranged side by side. The fan is arranged on an inner side or an outer side of the shell. The PFC module includes a PFC inductor arranged in the first air passage, and the PFC inductor faces directly to the fan. The DC-DC module is arranged in the first air passage. The DC-DC module includes at least one DC-DC conversion circuit, each of the DC-DC conversion circuits includes a first PCB and a transformer magnetic core, a transformer winding and power components arranged on the first PCB. The main board is arranged within the shell. The PFC inductor and the at least one DC-DC conversion circuit are electrically connected with the main board, respectively.

First claim

What is claimed is:

1. A high-density power supply, comprising:
a shell with a first air passage;
a fan arranged on an inner side or an outer side of the shell;
a power factor correction (PFC) module comprising a PFC inductor, wherein the PFC inductor is arranged in the first air passage, and the PFC inductor faces directly to the fan;
a direct current to direct current (DC-DC) module arranged in the first air passage, wherein the direct current to direct current (DC-DC) module is located on a side of the PFC inductor away from the fan in an exhaust direction of the fan, and wherein the DC-DC module comprises at least one DC-DC conversion circuit, each of the DC-DC conversion circuits comprises a first PCB and a transformer magnetic core, a transformer winding and power components, and the transformer magnetic core, the transformer winding and the power components are arranged on the first PCB, and the transformer magnetic core and the transformer winding together form a transformer;
a main board arranged within the shell, wherein the PFC inductor and the at least one DC-DC conversion circuit are electrically connected with the main board, respectively.

2. The high-density power supply according to claim 1 , wherein the DC-DC conversion circuit is a LLC resonant circuit.

3. The high-density power supply according to claim 1 , wherein the first PCB has a top side, a bottom side opposite to the top side, a left side and a right side opposite to the left side, the transformer magnetic core extends from the right side to the left side and from the top side to the bottom side of the first PCB, and the power components are adjacent to the left side and the bottom side of the first PCB.

4. The high-density power supply according to claim 3 , wherein a relative height between the power components and the first PCB is not higher than a relative height between the transformer magnetic core and the first PCB.

5. The high-density power supply according to claim 2 , wherein each of the LLC resonant circuits further comprises an inductor magnetic core and an inductor winding, and the inductor magnetic core and the inductor winding are arranged on the first PCB, and the inductor magnetic core and the inductor winding together form a resonant inductor.

6. The high-density power supply according to claim 1 , wherein the PFC inductor is positioned between the fan and the DC-DC module.

7. The high-density power supply according to claim 1 , wherein the PFC inductor comprises a PFC magnetic core with a central through-hole, and the central through-hole of the PFC magnetic core faces directly to the fan.

8. The high-density power supply according to claim 7 , wherein the shape of the magnetic core of the PFC inductor is a circular ring or a rectangle.

9. The high-density power supply according to claim 1 , wherein each of the DC-DC conversion circuits further comprises a second PCB and power components arranged on the second PCB.

10. The high-density power supply according to claim 9 , wherein the second PCB is positioned between the PFC inductor and the first PCB.

11. The high-density power supply according to claim 1 , wherein the shell further comprises a second air passage arranged side by side with the first air passage, the high-density power supply further comprises an EMI filter unit and a bus capacitor, and the EMI filter unit and the bus capacitor are arranged in the second air passage, and the EMI filter unit and the bus capacitor are electrically connected with the main board, respectively.

12. The high-density power supply according to claim 11 , wherein the PFC module further comprises a PFC circuit board, and the PFC circuit board is positioned between the PFC inductor and the EMI filter unit.

13. The high-density power supply according to claim 11 , further comprising an auxiliary power supply unit positioned between the bus capacitor and the DC-DC module.

14. The high-density power supply according to claim 13 , wherein the auxiliary power supply unit is arranged parallel with the bus capacitor.

15. The high-density power supply according to claim 11 , wherein the bus capacitor is arranged parallel with the main board.

16. The high-density power supply according to claim 11 , further comprising a control plate for controlling the power components on the PFC circuit board and the power components on the at least one DC-DC conversion circuit, wherein the control plate is arranged on one side of the bus capacitor and is electrically connected with the main board.

17. The high-density power supply according to claim 1 , wherein the high-density power supply has a dimension of 185 mm*73.5 mm*40 mm, 265 mm*73.5 mm*40 mm or 185 mm*73.5 mm*39 mm.

18. The high-density power supply according to claim 5 , wherein the inductor magnetic core and the transformer magnetic core are arranged side by side, and the inductor magnetic core is positioned on a left side of the transformer magnetic core.

19. The high-density power supply according to claim 5 , wherein the inductor magnetic core is integrated with the transformer magnetic core.

Assignees

• Delta Electronics Shanghai Co

Inventors

• Wang Kunpeng
• Zhang Mingjuan
• Du Shuailin
• Dong Kai

Classifications

• H02J7/70

  characterised by the mechanical construction · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H01F27/085

  Cooling by ambient air · CPC title

• H05K7/2089

  for power electronics, e.g. for inverters for controlling motor · CPC title

• H02M3/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title