Terminal manufacturing method

Patent metadata

Field	Value
Publication number	US-9203201-B2
Application number	US-201313866072-A
Country	US
Kind code	B2
Filing date	Apr 19, 2013
Priority date	Apr 27, 2012
Publication date	Dec 1, 2015
Grant date	Dec 1, 2015

Abstract

A manufacturing method is provided for a terminal ( 10 ) that has a board connecting portion ( 12 ) to be connected to a circular through hole (B 1 ) formed to penetrate through a board (B). The manufacturing method includes a wire drawing step of manufacturing a wire material having a polygonal cross-section with obtuse interior angles by drawing the wire material through an opening of a wire drawing die, the opening having a polygonal shape with obtuse inner angles. The method then includes a surface processing step of applying a surface processing to the wire material, and a cutting step of cutting the wire material having the surface processing applied thereto to a specified length to form the terminal ( 10 ).

First claim

What is claimed is:

1. A manufacturing method for a terminal including a board connecting portion to be connected to a circular through hole that penetrates through a board, comprising:
drawing a wire material through a polygonal opening of a wire drawing die to produce a wire material having a polygonal cross-section with obtuse interior angles;
applying a surface processing to the wire material; shaping the wire material to substantially taper a leading end part of the board connecting portion and removing the surface processing from the leading end portion; and
cutting the wire material having the surface processing applied thereto to a specified length to form the terminal.

2. The manufacturing method of claim 1 , wherein the wire material includes two parallel surfaces.

3. The manufacturing method of claim 1 , wherein the surface processing step comprises applying tin plating to the wire material.

4. The manufacturing method of claim 1 , wherein the wire material used as a base material is made of copper or copper alloy.

5. The manufacturing method of claim 1 , further comprising bending the terminal fitting to substantially have an L shape.

6. A manufacturing method for a terminal including a board connecting portion to be connected to a circular through hole that penetrates through a board, comprising:
manufacturing a wire material having a substantially rectangular cross-section with rounded corner parts by drawing the wire material through an opening of a wire drawing die, the opening having a substantially rectangular shape with rounded four corners;
applying a surface processing to the wire material;
shaping the wire material to substantially taper a leading end part of the board connecting portion and removing the surface processing from the leading end portion; and
cutting the wire material having the surface processing applied thereto to a specified length to form the terminal.

7. The manufacturing method of claim 6 , wherein the wire material includes two parallel surfaces.

8. The manufacturing method of claim 6 , wherein the surface processing step comprises applying tin plating to the wire material.

9. The manufacturing method of claim 6 , wherein the wire material used as a base material is made of copper or copper alloy.

10. The manufacturing method of claim 6 , further comprising bending the terminal fitting to substantially have an L shape.

11. A manufacturing method for a terminal including a board connecting portion to be connected to a circular through hole that penetrates through a board, comprising:
manufacturing a wire material having a circular cross-section by drawing the wire material through a circular opening of a wire drawing die;
applying a surface processing to the wire material;
shaping the wire material to substantially taper a leading end part of the board connecting portion and removing the surface processing from the leading end portion; and
cutting the wire material having the surface processing applied thereto to a specified length to form the terminal.

12. The manufacturing method of claim 11 , wherein the surface processing step comprises applying tin plating to the wire material.

13. The manufacturing method of claim 11 , wherein the wire material used as a base material is made of copper or copper alloy.

14. The manufacturing method of claim 11 , further comprising bending the terminal fitting to substantially have an L shape.

Assignees

• Sumitomo Wiring Systems

Inventors

• Kobayashi Kazumasa

Classifications

• H01R12/585 Primary

  Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board · CPC title

• H05K3/3415

  on both sides of the substrate or combined with lead-in-hole components · CPC title

• B21C3/00

  Profiling tools for metal drawing; Combinations of dies and mandrels for metal drawing · CPC title

• H01R43/16

  for manufacturing contact members, e.g. by punching and by bending · CPC title

• Y10T29/49153

  with shaping or forcing terminal into base aperture · CPC title