Signal transmission device

Patent metadata

Field	Value
Publication number	US-12417874-B2
Application number	US-202318181929-A
Country	US
Kind code	B2
Filing date	Mar 10, 2023
Priority date	Sep 21, 2022
Publication date	Sep 16, 2025
Grant date	Sep 16, 2025

Abstract

A signal transmission device according to the embodiment includes: a first integrated circuit chip provided with a first coil that constitutes the isolation transformer; a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer; a second integrated circuit chip having a first connection terminal and a second connection terminal provided on the upper surface; a first wire that electrically connects between one end of the second coil and the first connection terminal; and a second wire that electrically connects between the other end of the second coil and the second connection terminal, wherein the second coil is provided only in the wiring layer of the printed circuit board, which has a single wiring layer structure.

First claim

The invention claimed is:

1. A signal transmission device provided with an isolation transformer, comprising:
a first integrated circuit chip provided with a first coil that constitutes the isolation transformer;
a printed circuit board provided with a second coil that is magnetically coupled with the first coil to form the insulating transformer;
a second integrated circuit chip having a first connection terminal and a second connection terminal provided on the upper surface;
a first wire that electrically connects between one end of the second coil and the first connection terminal; and
a second wire that electrically connects between the other end of the second coil and the second connection terminal,
wherein the printed circuit board has only one wiring layer, and
wherein the second coil is provided only in the wiring layer of the printed circuit board, which has a single wiring layer structure.

2. The signal transmission device according to claim 1 ,
wherein the second coil includes a winding wound in the lateral direction in the wiring layer located on the upper surface of the printed circuit board and extending in the lateral direction.

3. The signal transmission device according to claim 1 ,
wherein the first integrated circuit chip includes:
a signal wiring provided in a lower wiring layer different from the upper wiring layer provided with the first coil and electrically connecting the integrated circuit provided in the first integrated circuit chip and the first coil, and
a via-hole wiring provided between the first coil and the signal wiring and electrically connecting the first coil and the signal wiring.

4. The signal transmission device according to claim 2 ,
wherein the first integrated circuit chip includes:
a signal wiring provided in a lower wiring layer different from the upper wiring layer provided with the first coil and electrically connecting the integrated circuit provided in the first integrated circuit chip and the first coil, and
a via-hole wiring provided between the first coil and the signal wiring and electrically connecting the first coil and the signal wiring.

5. The signal transmission device according to claim 1 ,
wherein the signal transmission device further comprises an adhesion layer positioned between the top surface of the first integrated circuit chip and the bottom surface of the printed circuit board and adhering the first integrated circuit chip and the printed circuit board.

6. The signal transmission device according to claim 2 ,
wherein the signal transmission device further comprises an adhesion layer positioned between the top surface of the first integrated circuit chip and the bottom surface of the printed circuit board and adhering the first integrated circuit chip and the printed circuit board.

7. The signal transmission device according to claim 1 ,
wherein the printed circuit board is fixed above the first integrated circuit so that the second coil is arranged above the first coil.

8. The signal transmission device according to claim 2 ,
wherein the printed circuit board is fixed above the first integrated circuit so that the second coil is arranged above the first coil.

9. The signal transmission device according to claim 1 ,
wherein the printed circuit board has an insulating film substrate, and
wherein the second coil is provided on the upper surface of the film substrate.

10. The signal transmission device according to claim 2 ,
wherein the printed circuit board has an insulating film substrate, and
wherein the second coil is provided on the upper surface of the film substrate.

Assignees

• Toshiba Kk
• Toshiba Electronic Devices & Storage Corp

Inventors

• Dang Bowen
• Murasaki Takeshi
• Kitahara Takaya
• Arai Makoto
• Ootaka Shoji

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/1053

  Mounted components directly electrically connected to each other, i.e. not via the PCB · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• H05K2201/10287

  Metal wires as connectors or conductors · CPC title