Micro device arrangement in donor substrate
US-11892497-B2 · Feb 6, 2024 · US
US12416664B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12416664-B2 |
| Application number | US-202318398124-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2023 |
| Priority date | Oct 4, 2016 |
| Publication date | Sep 16, 2025 |
| Grant date | Sep 16, 2025 |
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This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.
Opening claim text (preview).
We claim: 1. A method of populating a receiver substrate, the method comprising the steps of: preparing a plurality of microdevices on one or more donor substrates; transferring the plurality of microdevices from the one or more donor substrates to a cartridge substrate, the plurality of microdevices being arranged in arrays, separated by an interfering area in between, on the cartridge substrate; selecting one or more transferable sets of microdevices in the cartridge substrate; identifying a number of defective microdevices in each transferable set of microdevices; correcting the defective microdevices if a sum of the number of the identified defective microdevices is more than a threshold value; and aligning and transferring the selected one or more transferable sets of microdevices on the cartridge substrate to corresponding contact pads on the receiver substrate. 2. The method of claim 1 , wherein the number of defective microdevices are identified and corrected before or after transferring to the receiver substrate. 3. The method of claim 2 , wherein the defective microdevices are corrected by one of: repairing, replacing, or removing the defective microdevices in the cartridge substrate. 4. The method of claim 3 , wherein the defective microdevices are replaced with spare microdevices on the cartridge substrate. 5. The method of claim 1 , wherein the cartridge substrate includes different types of the plurality of microdevices, the different types of the plurality of microdevices being red color microdevices, blue color microdevices, or green color microdevices.
used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title
using temporarily an auxiliary support · CPC title
batch processes · CPC title
for alignment · CPC title
of die-attach connectors · CPC title
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