Micro device arrangement in donor substrate

US12416664B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12416664-B2
Application numberUS-202318398124-A
CountryUS
Kind codeB2
Filing dateDec 27, 2023
Priority dateOct 4, 2016
Publication dateSep 16, 2025
Grant dateSep 16, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

First claim

Opening claim text (preview).

We claim: 1. A method of populating a receiver substrate, the method comprising the steps of: preparing a plurality of microdevices on one or more donor substrates; transferring the plurality of microdevices from the one or more donor substrates to a cartridge substrate, the plurality of microdevices being arranged in arrays, separated by an interfering area in between, on the cartridge substrate; selecting one or more transferable sets of microdevices in the cartridge substrate; identifying a number of defective microdevices in each transferable set of microdevices; correcting the defective microdevices if a sum of the number of the identified defective microdevices is more than a threshold value; and aligning and transferring the selected one or more transferable sets of microdevices on the cartridge substrate to corresponding contact pads on the receiver substrate. 2. The method of claim 1 , wherein the number of defective microdevices are identified and corrected before or after transferring to the receiver substrate. 3. The method of claim 2 , wherein the defective microdevices are corrected by one of: repairing, replacing, or removing the defective microdevices in the cartridge substrate. 4. The method of claim 3 , wherein the defective microdevices are replaced with spare microdevices on the cartridge substrate. 5. The method of claim 1 , wherein the cartridge substrate includes different types of the plurality of microdevices, the different types of the plurality of microdevices being red color microdevices, blue color microdevices, or green color microdevices.

Assignees

Inventors

Classifications

  • used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

  • H10P72/74Primary

    using temporarily an auxiliary support · CPC title

  • batch processes · CPC title

  • for alignment · CPC title

  • H10W72/073Primary

    of die-attach connectors · CPC title

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Frequently asked questions

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What does patent US12416664B2 cover?
This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.
Who is the assignee on this patent?
Vuereal Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/74. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 16 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).