Optical window with embedded screen

Patent metadata

Field	Value
Publication number	US-12414279-B2
Application number	US-202318307571-A
Country	US
Kind code	B2
Filing date	Apr 26, 2023
Priority date	Apr 26, 2022
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A method of embedding a screen in a substrate includes placing the screen on the substrate, and then melting part of the substrate, so that the screen becomes embedded in the substrate. The melting may involve heating at least part of the screen to melt part of the substrate, or directly heating the part of the substrate. The screen may be a screen of electrically-conductive material, and the heating may be Joule heating in which an electrical current is passed through the screen to heat the screen. Alternatively, the heating may involve microwave, conductive, or laser heating. The produced device of the substrate with an embedded screen may be an optical window with an embedded electromagnetic interference (EMI) screen, may be a touch screen or touch display, or may be a window with an embedded heating element, to give a few non-limiting examples.

First claim

What is claimed is:

1. A method of embedding a screen in a substrate, the method comprising:
depositing electrically-conductive material along edges of a surface of the substrate;
placing the screen on the substrate such that the screen contacts the electrically-conductive material along the edges of the surface of the substrate; and
melting a portion of the substrate, resulting in at least part of the screen embedding into the substrate, wherein melting the portion of the substrate includes microwave heating of the screen.

2. The method of claim 1 , wherein the heating the screen includes heating the screen and substrate in a heated environment.

3. The method of claim 1 , wherein melting the portion of the substrate includes directly heating the substrate.

4. The method of claim 1 , wherein the substrate includes a non-electrically-conductive material.

5. The method of claim 1 , wherein depositing the electrically-conductive material occurs after masking the surface to leave the edges exposed.

Assignees

• Raytheon Co

Inventors

• Trent Catherine
• Ovalle-Robles Raquel
• Foreman James E

Classifications

• C03C27/02 Primary

  by fusing glass directly to metal · CPC title

• C03C3/321

  Chalcogenide glasses, e.g. containing S, Se, Te · CPC title

• C03C3/125

  containing aluminium as glass former · CPC title

• H05K9/0086 Primary

  comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering · CPC title