Piezoelectric microelectromechanical system microphone with compliant anchors

Patent metadata

Field	Value
Publication number	US-12413914-B2
Application number	US-202218049330-A
Country	US
Kind code	B2
Filing date	Oct 25, 2022
Priority date	Oct 27, 2021
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

First claim

What is claimed is:

1. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a circular diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm; and
a compliant anchor extending about a majority of a perimeter of the diaphragm, having a width of between 0% and about 15% of a radius of the diaphragm, and formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

2. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor has a length and substantially same width along an entirety of the length.

3. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor has a same height as a remainder of the diaphragm.

4. The piezoelectric microelectromechanical system microphone of claim 1 further comprising a sensing electrode including an inner sensing electrode disposed proximate a center of the diaphragm and an outer sensing electrode disposed proximate a perimeter of the diaphragm.

5. The piezoelectric microelectromechanical system microphone of claim 4 wherein the anchor region surrounds the outer sensing electrode.

6. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor is formed of a polymer.

7. The piezoelectric microelectromechanical system microphone of claim 6 wherein the compliant anchor is formed of one of polyimide, polymethylmethacrylate, or polydimethylsiloxane.

8. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor is formed of a dielectric material.

9. The piezoelectric microelectromechanical system microphone of claim 8 wherein the compliant anchor is formed of silicon dioxide.

10. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor is formed of a semiconductor.

11. The piezoelectric microelectromechanical system microphone of claim 1 wherein the compliant anchor is formed of silicon.

12. An electronics device module including the piezoelectric microelectromechanical system microphone of claim 1 .

13. An electronic device including the electronic device module of claim 12 .

14. A telephone including the electronic device module of claim 12 .

15. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm; and
a compliant anchor formed of a polymer with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

16. A piezoelectric microelectromechanical system microphone comprising:
a support substrate;
a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm; and
a compliant anchor formed of a semiconductor with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Assignees

• Skyworks Global Pte Ltd

Inventors

• Chen Guofeng
• Hui Yu
• Gu Myeong Gweon
• Lee Jae Hyung
• Jhung Jae Myoung

Classifications

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R17/02 Primary

  Microphones · CPC title