Semiconductor module

Patent metadata

Field	Value
Publication number	US-12412813-B2
Application number	US-202017794870-A
Country	US
Kind code	B2
Filing date	May 19, 2020
Priority date	May 19, 2020
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire.

First claim

The invention claimed is:

1. A semiconductor module comprising:
a base plate having a shape of a sheet;
a relay plate having a shape of a sheet;
a terminal member;
an electronic component joined to one surface of the base plate; and
a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, and bonding wire, wherein
the base plate, the relay plate, and the terminal member are electrically conductive members and arranged as a same plane with gaps between the electrically conductive members,
the electronic component and one surface of the relay plate are connected to each other by a first bonding wire,
the one surface of the relay plate and one surface of the terminal member are connected to each other by a second bonding wire,
the relay plate has a shape of a rectangular sheet,
if a direction parallel to a long side of the relay plate is defined as a long side direction, each bonding wire is connected to a one-side portion or an other-side portion in the long side direction of the relay plate,
the mold resin is formed in an external shape that is a shape of a rectangular sheet having a sheet surface parallel to the same plane, and
the relay plate is disposed such that one long side thereof extends along a side surface of the mold resin.

2. The semiconductor module according to claim 1 , wherein
the electronic component is disposed on one side in the long side direction relative to the relay plate,
the terminal member is disposed on another side in the long side direction relative to the relay plate, and
the first bonding wire is connected to the one-side portion in the long side direction of the relay plate.

3. The semiconductor module according to claim 2 , wherein the first bonding wire connecting the electronic component and the one surface of the relay plate to each other, and the second bonding wire connecting the one surface of the relay plate and the one surface of the terminal member to each other, constitute a single bonding wire.

4. The semiconductor module according to claim 1 , wherein the base plate, the relay plate, and the terminal member are made from a same material.

5. The semiconductor module according to claim 1 , wherein
each of the base plate, the relay plate, and the terminal member includes a terminal portion or an extending-out portion exposed to outside from a side surface of the mold resin, and
directions in which the terminal portion and the extending-out portion are exposed are directions parallel to the same plane.

6. The semiconductor module according to claim 5 , wherein
a width of the extending-out portion of the relay plate is shorter than a length of the long side of the relay plate, and
the extending-out portion of the relay plate is provided on a side, on which there is one long side of the relay plate, so as to be located at the one-side portion or the other-side portion in the long side direction of the relay plate.

7. The semiconductor module according to claim 3 , wherein each of the base plate, the relay plate, and the terminal member includes a terminal portion or an extending-out portion exposed to outside from a side surface of the mold resin,
directions in which the terminal portion and the extending-out portion are exposed are directions parallel to the same plane,
a width of the extending-out portion of the relay plate is shorter than a length of the long side of the relay plate, and
the extending-out portion of the relay plate is provided on a side, on which there is one long side of the relay plate, so as to be located at the one-side portion or the other-side portion in the long side direction of the relay plate.

8. The semiconductor module according to claim 7 , wherein the base plate, the relay plate, and the terminal member are made from a same material.

9. Means for preventing wire sag and wire sweep in a semiconductor module, comprising:
a base plate, a relay plate, and a terminal member being electrically conductive members and arranged as a same plane with gaps between the electrically conductive members;
a first bonding wire connecting the electronic component and one surface of the relay plate, and a second bonding wire connecting the terminal member and the one surface of the relay plate; and
a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, the first bonding wire, and the second bonding wire, wherein
the relay plate has a shape of a rectangular sheet,
if a direction parallel to a long side of the relay plate is defined as a long side direction, each bonding wire is connected to a one-side portion or an other-side portion in the long side direction of the relay plate,
the mold resin is formed in an external shape that is a shape of a rectangular sheet having a sheet surface parallel to the same plane, and
the relay plate is disposed such that one long side thereof extends along a side surface of the mold resin.

Assignees

• Mitsubishi Electric Corp

Inventors

• Takeuchi Kensuke

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/763

  between laterally-adjacent chips · CPC title

• H10W90/758

  between a chip and a stacked discrete passive device · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title